Inventor · disambiguated record
Tadashi Tomita
Also filed as: TOMITA TADASHI
12 granted patents·5 pending applications·212 citations·filing 1979–2025
89Inventor score
Top patents by PatentIndex Score
17 records- 0192US4408095AAcoustic apparatusCLARION CO LTD·Filed 1981·Granted Oct 4, 1983·80 cites·4 claims
- 0286US5631028AGreen tire conveyor system in a tire vulcanizer factoryKOBE STEEL LTD·Filed 1995·Granted May 20, 1997·58 cites·13 claims
- 0372US4323787AAutomatic power supply apparatusCLARION CO LTD·Filed 1979·Granted Apr 6, 1982·26 cites·2 claims
- 0467US2025382494A1Motor-sealing resin compositionSHINETSU CHEMICAL CO·Filed 2025·Application pending·0 cites
- 0563US5894458AApparatus for supporting and connecting a magnetic field modulation head to be used for a photomagnetic recording including a spring plate member having a conductive part electrically connecting the head to a supporting frameNIPPON CHEMICON·Filed 1996·Granted Apr 13, 1999·18 cites·6 claims
- 0662US6477720B2Sanitary washing device having automatic nozzle pipe washerAISIN SEIKI·Filed 2001·Granted Nov 12, 2002·14 cites·18 claims
- 0758US8032954B2Coupling member for toilet seat device with warm-water spraysAISIN SEIKI·Filed 2006·Granted Oct 11, 2011·1 cites·6 claims
- 0852US5186687AConstant velocity joint having cross groovesTOYODA MACHINE WORKS LTD·Filed 1991·Granted Feb 16, 1993·15 cites·5 claims
- 0948US10388837B2White heat-curable epoxy resin composition for optical semiconductor element encapsulation and optical semiconductor device using sameSHINETSU CHEMICAL CO·Filed 2017·Granted Aug 20, 2019·0 cites·7 claims
- 1047US9884960B2White heat-curable epoxy resin composition, optical semiconductor element case made of the white heat-curable epoxy resin composition and optical semiconductor device comprised of the caseSHINETSU CHEMICAL CO·Filed 2016·Granted Feb 6, 2018·0 cites·6 claims
- 1146US2017166730A1Light-reflecting white heat-curable epoxy resin composition and optical semiconductor device using sameSHINETSU CHEMICAL CO·Filed 2016·Application pending·0 cites
- 1244US10008646B2Heat-curable epoxy resin composition for optical semiconductor element encapsulation and optical semiconductor device using sameSHINETSU CHEMICAL CO·Filed 2016·Granted Jun 26, 2018·0 cites·4 claims
- 1344US9441104B2Heat-curable epoxy resin composition for optical semiconductor element encapsulation and optical semiconductor device using sameSHINETSU CHEMICAL CO·Filed 2015·Granted Sep 13, 2016·0 cites·7 claims
- 1443US2017373215A1Heat-curable silicone resin composition for primarily encapsulating photocoupler, photocoupler encapsulated by same, and optical semiconductor device having such photocouplerSHINETSU CHEMICAL CO·Filed 2017·Application pending·0 cites
- 1539US2016024294A1Heat-curable epoxy resin composition for encapsulating optical semiconductor element and optical semiconductor device using sameSHINETSU CHEMICAL CO·Filed 2015·Application pending·0 cites
- 1633US9403983B2White thermosetting silicone resin composition for a light-emitting semiconductor device and a case for installing a light-emitting semiconductor elementSHINETSU CHEMICAL CO·Filed 2015·Granted Aug 2, 2016·0 cites·17 claims
- 1727US2017088710A1Heat-curable silicone resin composition, optical semiconductor device and semiconductor package using molded product of sameSHINETSU CHEMICAL CO·Filed 2016·Application pending·0 cites
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