P

Inventor

SUK KYOUNG LIM

KR36 patents
⚠️ This page may combine multiple inventors who share the name “SUK KYOUNG LIM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

34 patents
US11152309B2Oct 19, 2021

Semiconductor package, method of fabricating semiconductor package, and method of fabricating redistribution structure

SAMSUNG ELECTRONICS CO LTD9 citations85
US10930625B2Feb 23, 2021

Semiconductor package and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD5 citations84
US10522471B2Dec 31, 2019

Semiconductor package and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD7 citations84
US11626393B2Apr 11, 2023

Semiconductor package and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD4 citations75
US11610785B2Mar 21, 2023

Semiconductor packages

SAMSUNG ELECTRONICS CO LTD4 citations74
US12170251B2Dec 17, 2024

Semiconductor package

SAMSUNG ELECTRONICS CO LTD2 citations73
US11869775B2Jan 9, 2024

Semiconductor packages

SAMSUNG ELECTRONICS CO LTD2 citations73
US11810915B2Nov 7, 2023

Semiconductor package with redistribution substrate having embedded passive device

SAMSUNG ELECTRONICS CO LTD2 citations73
US11348876B2May 31, 2022

Semiconductor package and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD2 citations73
US11107700B2Aug 31, 2021

Semiconductor package method of fabricating semiconductor package and method of fabricating re-distribution structure

SAMSUNG ELECTRONICS CO LTD2 citations73
US10879187B2Dec 29, 2020

Semiconductor package and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD2 citations73
US10622320B2Apr 14, 2020

Semiconductor package and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD4 citations72
US10741518B2Aug 11, 2020

Method of fabricating semiconductor package

SAMSUNG ELECTRONICS CO LTD2 citations71
US10546829B2Jan 28, 2020

Method of fabricating semiconductor package

SAMSUNG ELECTRONICS CO LTD1 citations71
US12453204B2Oct 21, 2025

Semiconductor package and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD0 citations62
US12394700B2Aug 19, 2025

Semiconductor package

SAMSUNG ELECTRONICS CO LTD0 citations62
US12381156B2Aug 5, 2025

Redistribution substrate and semiconductor package including the same

SAMSUNG ELECTRONICS CO LTD0 citations62
US12237256B2Feb 25, 2025

Semiconductor package

SAMSUNG ELECTRONICS CO LTD0 citations62
US12015018B2Jun 18, 2024

Semiconductor package with multiple redistribution substrates

SAMSUNG ELECTRONICS CO LTD0 citations62
US12009350B2Jun 11, 2024

Semiconductor package and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD0 citations62
US11804427B2Oct 31, 2023

Semiconductor package

SAMSUNG ELECTRONICS CO LTD0 citations62
US11694936B2Jul 4, 2023

Semiconductor package and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD0 citations62
US11605584B2Mar 14, 2023

Semiconductor package

SAMSUNG ELECTRONICS CO LTD1 citations62
US11538798B2Dec 27, 2022

Semiconductor package with multiple redistribution substrates

SAMSUNG ELECTRONICS CO LTD0 citations62
US10964643B2Mar 30, 2021

Semiconductor package and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD1 citations62
US11101231B2Aug 24, 2021

Semiconductor package and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD0 citations61
US11018108B2May 25, 2021

Method of fabricating semiconductor package

SAMSUNG ELECTRONICS CO LTD0 citations61
US12288780B2Apr 29, 2025

Semiconductor package

SAMSUNG ELECTRONICS CO LTD0 citations60
US12519086B2Jan 6, 2026

Semiconductor package with redistribution substrate

SAMSUNG ELECTRONICS CO LTD0 citations52
US12593737B2Mar 31, 2026

Semiconductor package

SAMSUNG ELECTRONICS CO LTD0 citations51
US12261106B2Mar 25, 2025

Semiconductor package

SAMSUNG ELECTRONICS CO LTD0 citations51
US12494412B2Dec 9, 2025

Semiconductor package

SAMSUNG ELECTRONICS CO LTD0 citations50
US12014975B2Jun 18, 2024

Semiconductor package

SAMSUNG ELECTRONICS CO LTD0 citations50
US11887931B2Jan 30, 2024

Semiconductor package with stepped redistribution structure exposing mold layer

SAMSUNG ELECTRONICS CO LTD0 citations47

JANG JAEGWON

1 patent

KIM DEOK HOON

1 patent