Inventor
ZHOU XIAOTIAN
US14 patents
⚠️ This page may combine multiple inventors who share the name “ZHOU XIAOTIAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
WESTERN DIGITAL FREMONT LLC
6 patentsUS9305583B1Apr 5, 2016
Method for fabricating a magnetic writer using multiple etches of damascene materials
WESTERN DIGITAL FREMONT LLC17 citations83
US8914969B1Dec 23, 2014
Method for providing a monolithic shield for a magnetic recording transducer
WESTERN DIGITAL FREMONT LLC4 citations72
US9940951B2Apr 10, 2018
PMR writer with non-conformal side gaps
WESTERN DIGITAL FREMONT LLC0 citations51
US9280990B1Mar 8, 2016
Method for fabricating a magnetic writer using multiple etches
WESTERN DIGITAL FREMONT LLC1 citations51
US9275657B1Mar 1, 2016
Process for making PMR writer with non-conformal side gaps
WESTERN DIGITAL FREMONT LLC1 citations51
US9263067B1Feb 16, 2016
Process for making PMR writer with constant side wall angle
WESTERN DIGITAL FREMONT LLC0 citations49
DIDREW TECH BVI LIMITED
3 patentsUS10424524B2Sep 24, 2019
Multiple wafers fabrication technique on large carrier with warpage control stiffener
DIDREW TECH BVI LIMITED6 citations71
US10209597B1Feb 19, 2019
System and method of manufacturing frameless LCD display
DIDREW TECH BVI LIMITED5 citations67
US10734326B2Aug 4, 2020
Hermetic flat top integrated heat spreader (IHS)/electromagnetic interference (EMI) shield package and method of manufacturing thereof for reducing warpage
DIDREW TECH BVI LIMITED0 citations39
CHENGDU ESWIN SIP TECH CO LTD
3 patentsUS11274234B2Mar 15, 2022
Adhesive composition for temporary bonding of semiconductor workpiece and support carrier pair
CHENGDU ESWIN SIP TECH CO LTD5 citations66
US11177153B2Nov 16, 2021
Method of debonding work-carrier pair with thin devices
CHENGDU ESWIN SIP TECH CO LTD0 citations59
US11488931B2Nov 1, 2022
Encapsulated fan-in semiconductor package with heat spreader and method of manufacturing the same
CHENGDU ESWIN SIP TECH CO LTD0 citations48