Inventor · disambiguated record
Hyung Mi Jung
Also filed as: JUNG HYUNG M · JUNG HYUNG MI
7 granted patents·15 pending applications·22 citations·filing 2005–2019
78Inventor score
Files withSAMSUNG ELECTRO MECH11SAMSUNG ELECTRONICS CO LTD5CHO JAE CHOON3JUNG HYUNG MI2BAEK SANG JIN1
Top patents by PatentIndex Score
22 records- 0182US7480980B2Planar magnetic inductor and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2007·Granted Jan 27, 2009·12 cites·8 claims
- 0274US10938090B2Antenna moduleSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 2, 2021·2 cites·20 claims
- 0372US7485411B2Method for manufacturing printed circuit board with thin film capacitor embedded thereinSAMSUNG ELECTRO MECH·Filed 2007·Granted Feb 3, 2009·6 cites·14 claims
- 0470US10242243B2Fingerprint sensor having printed circuit board and method of manufactureSAMSUNG ELECTRO MECH·Filed 2016·Granted Mar 26, 2019·2 cites·6 claims
- 0550US2019345325A1Resin composition for printed circuit board and integrated circuit package, and product using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
- 0650US2019345323A1Resin composition for printed circuit board and integrated circuit package, and product using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
- 0748US2019345326A1Low-loss insulating resin composition and insulating film using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
- 0848US2009310323A1Printed circuit board including electronic component embedded therein and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 0948US2014066544A1Insulating composition for multilayer printed circuit boardSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1047US7737529B2Printed circuit board with film capacitor embedded therein and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2006·Granted Jun 15, 2010·0 cites·18 claims
- 1147US2014182908A1Epoxy resin composition for insulating film, insulating film, and printed circuit board having the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1246US8309636B2Flame retardant resin composition for multilayer wiring board and multilayer wiring board including the sameJUNG HYUNG MI·Filed 2011·Granted Nov 13, 2012·0 cites·17 claims
- 1346US2008100986A1Capacitor embedded printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 1444US2009057860A1Semiconductor memory packageSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1544US2006152321A1Planar magnetic inductor and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2005·Application pending·0 cites
- 1642US2011314667A1Method of manufacturing printed circuit board including electronic component embedded thereinBAEK SANG JIN·Filed 2011·Application pending·0 cites
- 1740US2012103507A1Photosensitive composite and build-up insulation film with the photosensitive composite, and method for manufacturing circuit board using the build-up insulation filmCHO JAE CHOON·Filed 2011·Application pending·0 cites
- 1838US2011298786A1Color electronic paper display device and method for manufacturing the sameCHO JAE CHOON·Filed 2010·Application pending·0 cites
- 1934US2012125667A1Printed circuit board and method of manufacturing the sameJUNG HYUNG MI·Filed 2011·Application pending·0 cites
- 2034US2016244605A1Resin composition and printed circuit board comprising the sameSAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
- 2132US2011317382A1Insulating resin composition and printed circuit substrate using the sameCHO JAE CHOON·Filed 2010·Application pending·0 cites
- 2227US10950561B2Antenna moduleSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 16, 2021·0 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →