Inventor

MODI MITUL

US30 patents

⚠️ This page may combine multiple inventors who share the name “MODI MITUL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MODI MITUL

INTEL CORP

Die sidewall interconnects for 3D chip assemblies

Ultra-thin, hyper-density semiconductor packages

Mold shelf package design and process flow for advanced package architectures

Photonic integrated circuit packaging architectures

Stacked die cavity package

No mold shelf package design and process flow for advanced package architectures

No mold shelf package design and process flow for advanced package architectures

Coupled cooling fins in ultra-small systems

Semiconductor package with electromagnetic interference shielding structures

Electromagnetically shielded electronic devices and related systems and methods

Nested glass packaging architecture for hybrid electrical and optical communication devices

Ultra-thin, hyper-density semiconductor packages

Ultra-thin, hyper-density semiconductor packages

Open cavity bridge co-planar placement architectures and processes

Open cavity bridge power delivery architectures and processes

Substrate with thermal insulation

Active package cooling structures using molded substrate packaging technology

Stacked die cavity package

Thermal management solutions for integrated circuit packages

Dummy die structures of a packaged integrated circuit device

Chip-scale package architectures containing a die back side metal and a solder thermal interface material

Compliant integrated circuit package substrate

Compliant integrated circuit package substrate

Wideband multi-pin edge connector for radio frequency front end module

Electronic device packages with conformal EMI shielding and related methods

Electronic device packages with conformal EMI shielding and related methods

Embedded capacitors for reducing package cracking

Thermally coupled package-on-package semiconductor packages

Compliant structure for an electronic device, method of manufacturing same, and system containing same

SK HYNIX NAND PRODUCT SOLUTIONS CORP

Keep out zone with hydrophobic surface for integrated circuit (IC) package