Inventor

NICKERSON ROBERT M

US27 patents

⚠️ This page may combine multiple inventors who share the name “NICKERSON ROBERT M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NICKERSON ROBERT M

INTEL CORP

Interconnect structures with polymer core

Power distribution within a folded flex package method and apparatus

Folded substrate with interposer package for integrated circuit devices

Offset interposers for large-bottom packages and large-die package-on-package structures

Architecture material and process to improve thermal performance of the embedded die package

Integrated circuit interconnect

BBUL top side substrate layer enabling dual sided silicon interconnect and stacking flexibility

Offset interposers for large-bottom packages and large-die package-on-package structures

Offset interposers for large-bottom packages and large-die package-on-package structures

Offset interposers for large-bottom packages and large-die package-on-package structures

Package on package thermal transfer systems and methods

Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and PoP adhesive keep out zone

Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and pop adhesive keep out zone

Microelectronics package comprising a package-on-package (POP) architecture with inkjet barrier material for controlling bondline thickness and POP adhesive keep out zone

Through mold interconnect drill feature

Through mold interconnect drill feature

Laser ablation-based surface property modification and contamination removal

Laser ablation-based surface property modification and contamination removal

Package on package thermal transfer systems and methods

Interconnect structures with polymer core

Interconnect structures with polymer core

Pad-less interconnect for electrical coreless substrate

Integrated circuit device mounting with folded substrate and interposer

Thermally coupled package-on-package semiconductor packages

GANESAN SANKA

Package-on-package interconnect stiffener

MORTENSEN RUSSELL K

Offset interposers for large-bottom packages and large-die package-on-package structures

ARANA LEONEL R

Microelectronic package and method of manufacturing same