Inventor · disambiguated record
Haifa Hariri
Also filed as: HARIRI HAIFA
5 granted patents·9 pending applications·1 citations·filing 2017–2024
61Inventor score
Technology areasH10W
Top patents by PatentIndex Score
14 records- 0168US11552019B2Substrate patch reconstitution optionsINTEL CORP·Filed 2019·Granted Jan 10, 2023·1 cites·26 claims
- 0258US12381029B2Stepped coax MIL PTHS for modulating inductance within a packageINTEL CORP·Filed 2020·Granted Aug 5, 2025·0 cites·19 claims
- 0358US2025125201A1Package substrates with components included in cavities of glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 0458US2025126814A1Package substrates with components included in cavities of glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 0558US2025125202A1Package substrates with components included in cavities of glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 0658US2025120102A1Package substrates with components included in cavities of glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 0756US12224252B2Magnetic core inductors in interposerINTEL CORP·Filed 2020·Granted Feb 11, 2025·0 cites·25 claims
- 0855US2025113434A1Through glass via (tgv) with modulated profile for core stress reductionINTEL CORP·Filed 2023·Application pending·0 cites
- 0951US2025183182A1Microelectronic assemblies with through-glass via stress alleviation in glass coresSHAN BOHAN·Filed 2023·Application pending·0 cites
- 1050US2024105575A1Electrolytic surface finish architectureINTEL CORP·Filed 2022·Application pending·0 cites
- 1149US2024006298A1Substrate having one or more electrical interconnectsINTEL CORP·Filed 2022·Application pending·0 cites
- 1246US12336197B2In-plane inductors in IC packagesINTEL CORP·Filed 2020·Granted Jun 17, 2025·0 cites·19 claims
- 1344US2021305138A1Package land pad in closed-loop trace for high speed data signalingINTEL CORP·Filed 2020·Application pending·0 cites
- 1435US11222877B2Thermally coupled package-on-package semiconductor packagesINTEL CORP·Filed 2017·Granted Jan 11, 2022·0 cites·25 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →