Inventor
RUMER CHRISTOPHER L
US28 patents
⚠️ This page may combine multiple inventors who share the name “RUMER CHRISTOPHER L”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
27 patentsUS6924551B2Aug 2, 2005
Through silicon via, folded flex microelectronic package
INTEL CORP652 citations98
US6748350B2Jun 8, 2004
Method to compensate for stress between heat spreader and thermal interface material
INTEL CORP61 citations96
US6992891B2Jan 31, 2006
Metal ball attachment of heat dissipation devices
INTEL CORP58 citations93
US7846778B2Dec 7, 2010
Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly
INTEL CORP24 citations92
US7527090B2May 5, 2009
Heat dissipating device with preselected designed interface for thermal interface materials
INTEL CORP24 citations92
US7473995B2Jan 6, 2009
Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly
INTEL CORP39 citations92
US7311967B2Dec 25, 2007
Thermal interface material and electronic assembly having such a thermal interface material
INTEL CORP28 citations92
US7247517B2Jul 24, 2007
Method and apparatus for a dual substrate package
INTEL CORP37 citations92
US7169687B2Jan 30, 2007
Laser micromachining method
INTEL CORP43 citations92
US6974723B2Dec 13, 2005
Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials
INTEL CORP25 citations92
US6841867B2Jan 11, 2005
Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials
INTEL CORP24 citations92
US7303977B2Dec 4, 2007
Laser micromachining method
INTEL CORP40 citations91
US7279362B2Oct 9, 2007
Semiconductor wafer coat layers and methods therefor
INTEL CORP18 citations91
US6892927B2May 17, 2005
Method and apparatus for bonding a wire to a bond pad on a device
INTEL CORP29 citations91
US7611966B2Nov 3, 2009
Dual pulsed beam laser micromachining method
INTEL CORP8 citations83
US6982492B2Jan 3, 2006
No-flow underfill composition and method
INTEL CORP14 citations83
US7897486B2Mar 1, 2011
Semiconductor wafer coat layers and methods therefor
INTEL CORP7 citations82
US7304381B2Dec 4, 2007
Package and method for attaching an integrated heat spreader
INTEL CORP12 citations79
US7358606B2Apr 15, 2008
Apparatus to compensate for stress between heat spreader and thermal interface material
INTEL CORP6 citations74
US7059045B2Jun 13, 2006
Method for handling integrated circuit die
INTEL CORP7 citations74
US6911726B2Jun 28, 2005
Microelectronic packaging and methods for thermally protecting package interconnects and components
INTEL CORP10 citations74
US7996989B2Aug 16, 2011
Heat dissipating device with preselected designed interface for thermal interface materials
INTEL CORP4 citations63
US11056466B2Jul 6, 2021
Package on package thermal transfer systems and methods
INTEL CORP0 citations62
US7619318B2Nov 17, 2009
No-flow underfill composition and method
INTEL CORP4 citations61
US6867124B1Mar 15, 2005
Integrated circuit packaging design and method
INTEL CORP3 citations61
US10438930B2Oct 8, 2019
Package on package thermal transfer systems and methods
INTEL CORP0 citations52
US11222877B2Jan 11, 2022
Thermally coupled package-on-package semiconductor packages
INTEL CORP0 citations47