Inventor
BAJWA ADEEL A
US3 patents
Patents
3 patentsUS10930601B2Feb 23, 2021
Flexible fan-out wafer level process and structure
UNIV CALIFORNIA2 citations69
US11257746B2Feb 22, 2022
Power distribution within silicon interconnect fabric
UNIV CALIFORNIA0 citations55
US11239542B2Feb 1, 2022
Network on interconnect fabric and integrated antenna
UNIV CALIFORNIA0 citations54