Inventor

YAN JUNRONG

CN21 patents

⚠️ This page may combine multiple inventors who share the name “YAN JUNRONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

YAN JUNRONG

WESTERN DIGITAL TECH INC

Aperture structure on semiconductor component backside to alleviate delamination in stacked packaging

Semiconductor device with top die positioned to reduce die cracking

Vertical semiconductor device with side grooves

Semiconductor wafer thinned by horizontal stealth lasing

Semiconductor device including vertical wire bonds

Wire bonding for semiconductor devices

Mold compound dispensing system and method

Sloped interconnector for stacked die package

SANDISK SEMICONDUCTOR SHANGHAI CO LTD

Semiconductor device including corner recess

Semiconductor device including dual pad wire bond interconnection

Semiconductor device including die bond pads at a die edge

Semiconductor device including conductive bump interconnections

SUNWAVE COMM CO LTD

Method for distributing pilot frequency in massive antenna system

Method for avoiding downlink interference between indoor DAS system and small base station

Method for resisting small base station uplink signal interference of indoor DAS system based on antenna selection

AMAZON TECH INC

Detecting interference in depth images captured using overlapping depth cameras

Detecting interference in depth images captured using overlapping depth cameras

SANDISK TECHNOLOGIES INC

Semiconductor device with reduced stress die pick and place

Dicing and wafer thinning to form semiconductor dies

GEN ELECTRIC

Blockchain enabled collaborative transaction information processing for a supply chain

SANDISK SEMICONDUCTOR (SHANGHAI) CO LTD

Spacer layer for embedding semiconductor die