Inventor
TSENG SHU-JUNG
TW8 patents
⚠️ This page may combine multiple inventors who share the name “TSENG SHU-JUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
6 patentsUS11817382B2Nov 14, 2023
Package substrate insulation opening design
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US11251114B2Feb 15, 2022
Package substrate insulation opening design
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations71
US12368092B2Jul 22, 2025
Package substrate insulation opening design
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US12107038B2Oct 1, 2024
Semiconductor packages
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11600562B2Mar 7, 2023
Semiconductor packages and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations60
US12469834B2Nov 11, 2025
Semiconductor package and semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations48