Inventor

Yu de-wei

TW45 patents

⚠️ This page may combine multiple inventors who share the name “Yu de-wei”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

Yu de-wei

TAIWAN SEMICONDUCTOR MFG CO LTD

Interlayer dielectric film in semiconductor devices

Interlayer dielectric film in semiconductor devices

Post UV cure for gapfill improvement

Gap-filling germanium through selective bottom-up growth

Selective film growth for bottom-up gap filling

Cap layer and anneal for gapfill improvement

Selective film growth for bottom-up gap filling

Method of semiconductor integrated circuit fabrication

Method of semiconductor integrated circuit fabrication

Selective silicon growth for gapfill improvement

Selective silicon growth for gapfill improvement

Method of manufacturing a semiconductor device and a semiconductor device

Method of gap filling using conformal deposition-annealing-etching cycle for reducing seam void and bending

Methods for doping Fin field-effect transistors and Fin field-effect transistor

Semiconductor device and method for manufacture

Defect filling in patterned layer

Method for forming a FinFET structure that prevents or reduces deformation of adjacent fins

Cap layer and anneal for gapfill improvement

Selective silicon growth for gapfill improvement

Gapfill improvement

Systems and methods for semiconductor device process determination using reflectivity measurement

Semiconductor device and method

Method of performing gap filling including filling trenches between dummy gate stacks on semiconductor fins/strips with semiconductor material

Semiconductor device and method

Method of manufacturing a semiconductor device and a semiconductor device

Method of gap filling using conformal deposition-annealing-etching cycle for reducing seam void and bending

Method of gap filling using conformal deposition-annealing-etching cycle for reducing seam void and bending

Post UV cure for gapfill improvement

Method of manufacturing a semiconductor device and a semiconductor device

Method of semiconductor integrated circuit fabrication

Method of semiconductor integrated circuit fabrication

Interlayer dielectric film in semiconductor devices

Selective film growth for bottom-up gap filling

Method of semiconductor integrated circuit fabrication

Gap-filling germanium through selective bottom-up growth

Semiconductor device structure with salicide layer and method for forming the same

Semiconductor device and method

Fin bending reduction through structure design

TAIWAN SEMICONDUCTOR MFG

Methods for doping fin field-effect transistors

System for semiconductor device characterization using reflectivity measurement

Method of forming a semiconductor device

TSAI CHUN HSIUNG

Methods for doping fin field-effect transistors

Method and system for semiconductor device pattern loading effect characterization

FANG ZIWEI

Method of forming a semiconductor device

Yu de-wei

Methods of forming integrated circuits