Inventor
WANG WEN-CHOU V
US13 patents
Patents
13 patentsUS5454161AOct 3, 1995
Through hole interconnect substrate fabrication process
FUJITSU LTD256 citations99
US5514906AMay 7, 1996
Apparatus for cooling semiconductor chips in multichip modules
FUJITSU LTD158 citations98
US5474458ADec 12, 1995
Interconnect carriers having high-density vertical connectors and methods for making the same
FUJITSU LTD136 citations98
US5426563AJun 20, 1995
Three-dimensional multichip module
FUJITSU LTD127 citations98
US5544017AAug 6, 1996
Multichip module substrate
FUJITSU LTD91 citations96
US5455064AOct 3, 1995
Process for fabricating a substrate with thin film capacitor and insulating plug
FUJITSU LTD57 citations96
US5419038AMay 30, 1995
Method for fabricating thin-film interconnector
FUJITSU LTD96 citations96
US5404265AApr 4, 1995
Interconnect capacitors
FUJITSU LTD85 citations96
US5475262ADec 12, 1995
Functional substrates for packaging semiconductor chips
FUJITSU LTD39 citations92
US5382827AJan 17, 1995
Functional substrates for packaging semiconductor chips
FUJITSU LTD44 citations92
US5376586ADec 27, 1994
Method of curing thin films of organic dielectric material
FUJITSU LTD23 citations92
US5323520AJun 28, 1994
Process for fabricating a substrate with thin film capacitor
FUJITSU LTD35 citations92
US5406446AApr 11, 1995
Thin film capacitor
FUJITSU LTD17 citations82