Inventor
JEON GWANG JAE
KR5 patents
Patents
5 patentsUS11373980B2Jun 28, 2022
Semiconductor package
SAMSUNG ELECTRONICS CO LTD3 citations70
US12046526B2Jul 23, 2024
Methods of fabricating semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations61
US11715645B2Aug 1, 2023
Method for fabricating semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations61
US11328970B2May 10, 2022
Methods of fabricating semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations61
US11322368B2May 3, 2022
Method for fabricating semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations61