Inventor
HUANG FU YU
TW7 patents
⚠️ This page may combine multiple inventors who share the name “HUANG FU YU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ORIENT SEMICONDUCTOR ELECT LTD
5 patentsUS6499648B2Dec 31, 2002
Method and device for making a metal bump with an increased height
ORIENT SEMICONDUCTOR ELECT LTD9 citations70
US6390356B1May 21, 2002
Method of forming cylindrical bumps on a substrate for integrated circuits
ORIENT SEMICONDUCTOR ELECT LTD5 citations60
US6358834B1Mar 19, 2002
Method of forming bumps on wafers or substrates
ORIENT SEMICONDUCTOR ELECT LTD6 citations60
US6567270B2May 20, 2003
Semiconductor chip package with cooling arrangement
ORIENT SEMICONDUCTOR ELECT LTD6 citations59
US6274491B1Aug 14, 2001
Process of manufacturing thin ball grid array substrates
ORIENT SEMICONDUCTOR ELECT LTD6 citations58