Inventor

KIYOMURA HIROYUKI

JP7 patents

Patents

7 patents

US6467158B1Oct 22, 2002

Component feeder with load position alignment recognition

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD26 citations92

US6902101B2Jun 7, 2005

Bump bonding method apparatus

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD15 citations83

US6647616B1Nov 18, 2003

Bump bonding unit with tray storage and transport apparatuses

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD17 citations83

US6474538B1Nov 5, 2002

Bonding apparatus and bonding method

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD16 citations83

US6129203AOct 10, 2000

IC discarding apparatus for flip chip mounting facility

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD7 citations70

US6712111B2Mar 30, 2004

Bonding method and apparatus

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD4 citations62

US6680221B2Jan 20, 2004

Bare chip mounting method and bare chip mounting system

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD2 citations62