Inventor

GOH WEI CHUAN

SG3 patents

⚠️ This page may combine multiple inventors who share the name “GOH WEI CHUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MATERION CORP

2 patents

US11227806B2Jan 18, 2022

Air cavity package using high temperature silicone adhesive

MATERION CORP0 citations54

US10163743B2Dec 25, 2018

Copper flanged air cavity packages for high frequency devices

MATERION CORP0 citations43

ADAPTEC INC

1 patent

US6804739B1Oct 12, 2004

Structure and method for message snooping in SCSI bus expanders

ADAPTEC INC17 citations81