Inventor
WONG LIN-YIN
TW8 patents
⚠️ This page may combine multiple inventors who share the name “WONG LIN-YIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
PHOENIX PREC TECHNOLOGY CORP
6 patentsUS7050304B2May 23, 2006
Heat sink structure with embedded electronic components for semiconductor package
PHOENIX PREC TECHNOLOGY CORP64 citations97
US7656015B2Feb 2, 2010
Packaging substrate having heat-dissipating structure
PHOENIX PREC TECHNOLOGY CORP24 citations91
US7507915B2Mar 24, 2009
Stack structure of carrier boards embedded with semiconductor components and method for fabricating the same
PHOENIX PREC TECHNOLOGY CORP31 citations91
US7323762B2Jan 29, 2008
Semiconductor package substrate with embedded resistors and method for fabricating the same
PHOENIX PREC TECHNOLOGY CORP13 citations81
US7396753B2Jul 8, 2008
Semiconductor package substrate having bonding pads with plated layer thereon and process of manufacturing the same
PHOENIX PREC TECHNOLOGY CORP14 citations80
US7135377B1Nov 14, 2006
Semiconductor package substrate with embedded resistors and method for fabricating same
PHOENIX PREC TECHNOLOGY CORP5 citations60