Inventor
TSAI WANG-HSIANG
TW4 patents
Patents
4 patentsUS7968991B2Jun 28, 2011
Stacked package module and board having exposed ends
UNIMICRON TECHNOLOGY CORP32 citations89
US11127664B2Sep 21, 2021
Circuit board and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP2 citations71
US11895780B2Feb 6, 2024
Manufacturing method of package structure
UNIMICRON TECHNOLOGY CORP0 citations49
US11477886B2Oct 18, 2022
Circuit board structure and spliced circuit board
UNIMICRON TECHNOLOGY CORP0 citations42