Inventor
KURAMOTO MASAFUMI
JP62 patents
⚠️ This page may combine multiple inventors who share the name “KURAMOTO MASAFUMI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NICHIA CORP
40 patentsUS6924596B2Aug 2, 2005
Light emitting apparatus provided with fluorescent substance and semiconductor light emitting device, and method of manufacturing the same
NICHIA CORP79 citations97
US9634204B2Apr 25, 2017
Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same
NICHIA CORP4 citations84
US7527991B2May 5, 2009
Light emitting apparatus provided with fluorescent substance and semiconductor light emitting device, and method of manufacturing the same
NICHIA CORP12 citations83
US9893250B1Feb 13, 2018
Light emitting device having silicone resin-based sealing member
NICHIA CORP11 citations81
US10686102B2Jun 16, 2020
Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same
NICHIA CORP2 citations73
US10941304B2Mar 9, 2021
Metal powder sintering paste and method of producing the same, and method of producing conductive material
NICHIA CORP3 citations71
US9331251B2May 3, 2016
Light emitting device
NICHIA CORP3 citations69
US11652197B2May 16, 2023
Method for producing an electronic device
NICHIA CORP0 citations62
US11631790B2Apr 18, 2023
Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same
NICHIA CORP0 citations62
US11168865B2Nov 9, 2021
Light-emitting device and backlight
NICHIA CORP1 citations62
US11114583B2Sep 7, 2021
Light emitting device encapsulated above electrodes
NICHIA CORP0 citations62
US10971656B2Apr 6, 2021
Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same
NICHIA CORP0 citations62
US10950770B2Mar 16, 2021
Method for producing an electronic device
NICHIA CORP0 citations62
US12447528B2Oct 21, 2025
Resin impregnation method, method of manufacturing wavelength-conversion module, and wavelength-conversion module
NICHIA CORP0 citations61
US12125607B2Oct 22, 2024
Metal powder sintering paste and method of producing the same, and method of producing conductive material
NICHIA CORP0 citations61
US11752551B2Sep 12, 2023
Resin impregnation method, method of manufacturing wavelength-conversion module, and wavelength-conversion module
NICHIA CORP0 citations61
US11739238B2Aug 29, 2023
Electrically conductive adhesive and electrically conductive material
NICHIA CORP0 citations61
US11634596B2Apr 25, 2023
Metal powder sintering paste and method of producing the same, and method of producing conductive material
NICHIA CORP0 citations61
US11162004B2Nov 2, 2021
Electrically conductive adhesive and electrically conductive material
NICHIA CORP0 citations61
US12105013B2Oct 1, 2024
Curable resin composition, method for producing curable resin composition, and method for measuring surface tackiness of viscoelastic material
NICHIA CORP0 citations59
US10978623B2Apr 13, 2021
Light emitting element including adhesive member containing particles
NICHIA CORP0 citations57
US11643553B2May 9, 2023
Silicone resin composition and method of producing same
NICHIA CORP0 citations55
US11508885B2Nov 22, 2022
Light emitting device
NICHIA CORP0 citations52
US10573795B2Feb 25, 2020
Method for producing conductive material, conductive material obtained by the method, electronic device containing the conductive material, light-emitting device, and method for producing light-emitting device
NICHIA CORP0 citations52
US10535794B2Jan 14, 2020
Method for manufacturing light emitting device using a releasable base material
NICHIA CORP0 citations52
US10263161B2Apr 16, 2019
Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same
NICHIA CORP0 citations52
US10134955B2Nov 20, 2018
Light emitting element and method of manufacturing the same
NICHIA CORP0 citations52
US9929318B2Mar 27, 2018
Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same
NICHIA CORP0 citations52
US9812624B2Nov 7, 2017
Method for producing conductive material, conductive material obtained by the method, electronic device containing the conductive material, light-emitting device, and method for producing light-emitting device
NICHIA CORP0 citations52
US9808970B2Nov 7, 2017
Light-emitting device, method for manufacturing same, and molded part
NICHIA CORP0 citations52
US9748455B2Aug 29, 2017
Semiconductor element, semiconductor device including the same, and method for manufacturing semiconductor element
NICHIA CORP0 citations52
US9502610B2Nov 22, 2016
Method for manufacturing light emitting device
NICHIA CORP1 citations52
US9362190B2Jun 7, 2016
Semiconductor element, semiconductor device including the same, and method for manufacturing semiconductor element
NICHIA CORP1 citations52
US10707388B2Jul 7, 2020
Semiconductor device, and method for manufacturing semiconductor device
NICHIA CORP0 citations51
US10593851B2Mar 17, 2020
Metal powder sintering paste, method for producing the same, and method for producing conductive material
NICHIA CORP0 citations51
US9034671B2May 19, 2015
Light-emitting device and method for manufacturing same
NICHIA CORP0 citations51
US8803159B2Aug 12, 2014
Light-emitting device and method for manufacturing same
NICHIA CORP0 citations51
US12356773B2Jul 8, 2025
Wavelength conversion member, light emitting device, and method for producing wavelength conversion member
NICHIA CORP0 citations50
US9960326B2May 1, 2018
Light emitting device
NICHIA CORP0 citations50
US9653662B2May 16, 2017
Light emitting device
NICHIA CORP0 citations50
KURAMOTO MASAFUMI
6 patentsUS8575632B2Nov 5, 2013
Light-emitting device, method for manufacturing same, molded body and sealing member
KURAMOTO MASAFUMI49 citations96
US9502624B2Nov 22, 2016
Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same
KURAMOTO MASAFUMI11 citations92
US8968608B2Mar 3, 2015
Method for producing conductive material, conductive material obtained by the method, electronic device containing the conductive material, light-emitting device, and method for producing light-emitting device
KURAMOTO MASAFUMI4 citations83
US10090446B2Oct 2, 2018
Light emitting device and method for manufacturing the same
KURAMOTO MASAFUMI3 citations72
US9011728B2Apr 21, 2015
Method for producing conductive material, conductive material obtained by the method, electronic device containing the conductive material, and light-emitting device
KURAMOTO MASAFUMI0 citations51
US8836130B2Sep 16, 2014
Light emitting semiconductor element bonded to a base by a silver coating
KURAMOTO MASAFUMI1 citations51
KANEKA CORP
2 patentsUS7785715B2Aug 31, 2010
Curable composition and method of preparing same, light-shielding paste, light-shielding resin and method of forming same, light-emitting diode package and semiconductor device
KANEKA CORP27 citations91
US7371462B2May 13, 2008
Hardenable composition, hardening product, process for producing the same and light emitting diode sealed with the hardening product
KANEKA CORP22 citations91
HASHIMOTO KAZUHIKO
1 patentHAYASHI MASAKI
1 patentShowing the top 50 of 62 patents by PatentIndex Score.