P

Inventor

KURAMOTO MASAFUMI

JP62 patents
⚠️ This page may combine multiple inventors who share the name “KURAMOTO MASAFUMI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NICHIA CORP

40 patents
US6924596B2Aug 2, 2005

Light emitting apparatus provided with fluorescent substance and semiconductor light emitting device, and method of manufacturing the same

NICHIA CORP79 citations97
US9634204B2Apr 25, 2017

Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same

NICHIA CORP4 citations84
US7527991B2May 5, 2009

Light emitting apparatus provided with fluorescent substance and semiconductor light emitting device, and method of manufacturing the same

NICHIA CORP12 citations83
US9893250B1Feb 13, 2018

Light emitting device having silicone resin-based sealing member

NICHIA CORP11 citations81
US10686102B2Jun 16, 2020

Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same

NICHIA CORP2 citations73
US10941304B2Mar 9, 2021

Metal powder sintering paste and method of producing the same, and method of producing conductive material

NICHIA CORP3 citations71
US9331251B2May 3, 2016

Light emitting device

NICHIA CORP3 citations69
US11652197B2May 16, 2023

Method for producing an electronic device

NICHIA CORP0 citations62
US11631790B2Apr 18, 2023

Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same

NICHIA CORP0 citations62
US11168865B2Nov 9, 2021

Light-emitting device and backlight

NICHIA CORP1 citations62
US11114583B2Sep 7, 2021

Light emitting device encapsulated above electrodes

NICHIA CORP0 citations62
US10971656B2Apr 6, 2021

Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same

NICHIA CORP0 citations62
US10950770B2Mar 16, 2021

Method for producing an electronic device

NICHIA CORP0 citations62
US12447528B2Oct 21, 2025

Resin impregnation method, method of manufacturing wavelength-conversion module, and wavelength-conversion module

NICHIA CORP0 citations61
US12125607B2Oct 22, 2024

Metal powder sintering paste and method of producing the same, and method of producing conductive material

NICHIA CORP0 citations61
US11752551B2Sep 12, 2023

Resin impregnation method, method of manufacturing wavelength-conversion module, and wavelength-conversion module

NICHIA CORP0 citations61
US11739238B2Aug 29, 2023

Electrically conductive adhesive and electrically conductive material

NICHIA CORP0 citations61
US11634596B2Apr 25, 2023

Metal powder sintering paste and method of producing the same, and method of producing conductive material

NICHIA CORP0 citations61
US11162004B2Nov 2, 2021

Electrically conductive adhesive and electrically conductive material

NICHIA CORP0 citations61
US12105013B2Oct 1, 2024

Curable resin composition, method for producing curable resin composition, and method for measuring surface tackiness of viscoelastic material

NICHIA CORP0 citations59
US10978623B2Apr 13, 2021

Light emitting element including adhesive member containing particles

NICHIA CORP0 citations57
US11643553B2May 9, 2023

Silicone resin composition and method of producing same

NICHIA CORP0 citations55
US11508885B2Nov 22, 2022

Light emitting device

NICHIA CORP0 citations52
US10573795B2Feb 25, 2020

Method for producing conductive material, conductive material obtained by the method, electronic device containing the conductive material, light-emitting device, and method for producing light-emitting device

NICHIA CORP0 citations52
US10535794B2Jan 14, 2020

Method for manufacturing light emitting device using a releasable base material

NICHIA CORP0 citations52
US10263161B2Apr 16, 2019

Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same

NICHIA CORP0 citations52
US10134955B2Nov 20, 2018

Light emitting element and method of manufacturing the same

NICHIA CORP0 citations52
US9929318B2Mar 27, 2018

Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same

NICHIA CORP0 citations52
US9812624B2Nov 7, 2017

Method for producing conductive material, conductive material obtained by the method, electronic device containing the conductive material, light-emitting device, and method for producing light-emitting device

NICHIA CORP0 citations52
US9808970B2Nov 7, 2017

Light-emitting device, method for manufacturing same, and molded part

NICHIA CORP0 citations52
US9748455B2Aug 29, 2017

Semiconductor element, semiconductor device including the same, and method for manufacturing semiconductor element

NICHIA CORP0 citations52
US9502610B2Nov 22, 2016

Method for manufacturing light emitting device

NICHIA CORP1 citations52
US9362190B2Jun 7, 2016

Semiconductor element, semiconductor device including the same, and method for manufacturing semiconductor element

NICHIA CORP1 citations52
US10707388B2Jul 7, 2020

Semiconductor device, and method for manufacturing semiconductor device

NICHIA CORP0 citations51
US10593851B2Mar 17, 2020

Metal powder sintering paste, method for producing the same, and method for producing conductive material

NICHIA CORP0 citations51
US9034671B2May 19, 2015

Light-emitting device and method for manufacturing same

NICHIA CORP0 citations51
US8803159B2Aug 12, 2014

Light-emitting device and method for manufacturing same

NICHIA CORP0 citations51
US12356773B2Jul 8, 2025

Wavelength conversion member, light emitting device, and method for producing wavelength conversion member

NICHIA CORP0 citations50
US9960326B2May 1, 2018

Light emitting device

NICHIA CORP0 citations50
US9653662B2May 16, 2017

Light emitting device

NICHIA CORP0 citations50

KURAMOTO MASAFUMI

6 patents

KANEKA CORP

2 patents

HASHIMOTO KAZUHIKO

1 patent

HAYASHI MASAKI

1 patent

Showing the top 50 of 62 patents by PatentIndex Score.