Inventor

LIN WEN HSIN

TW78 patents

⚠️ This page may combine multiple inventors who share the name “LIN WEN HSIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIN WEN HSIN

VANGUARD INT SEMICONDUCT CORP

Semiconductor device and method for manufacturing the same

JFET and method for fabricating the same

Method and apparatus for power device with multiple doped regions

Semiconductor device and method for manufacturing the same

High-voltage semiconductor device and method for manufacturing the same

Semiconductor devices and methods for forming the same

Junction field effect transistor (JFET) with first and second top layer of opposite conductivity type for high driving current and low pinch-off voltage

Semiconductor device and method for manufacturing the same

Method and apparatus for power device with multiple doped regions

Method and apparatus for power device with depletion structure

High-voltage semiconductor device and method for manufacturing the same

High-voltage semiconductor structure

High-side circuits with modified diode and layout placement thereof

Electrostatic discharge protection circuit and electronic circuit

Semiconductor structure having conductive layer overlapping field oxide

Semiconductor device and method for manufacturing the same

Electrostatic discharge protection circuit

Electrostatic discharge protection device

Semiconductor structure

CHANG CHUN PETROCHEMICAL CO LTD

Ethylene-vinyl alcohol copolymer resin composition, film, and multi-layer structure comprising the same, as well as methods thereof

Ethylene-vinyl alcohol resin, film, and multi-layer structure comprising the same, and method for forming the ethylene-vinyl alcohol resin

Ethylene-vinyl alcohol copolymer composition with improved oxygen barrier properties

Ethylene vinyl alcohol pellets as well as films thereof

Ethylene-vinyl alcohol copolymer resin composition, ethylene-vinyl alcohol copolymer film formed therefrom, and multilayer structure containing the same

Ethylene-vinyl alcohol copolymer and producing method thereof

Ethylene-vinyl alcohol copolymer resin particle composition, ethylene-vinyl alcohol copolymer film formed therefrom, and multilayer structure

Ethylene-vinyl alcohol copolymer resin particle composition, ethylene-vinyl alcohol copolymer film formed therefrom, and multilayer structure

Ethylene-vinyl alcohol copolymer resin particle composition, ethylene-vinyl alcohol copolymer film formed therefrom, and multilayer structure

Ethylene-vinyl alcohol copolymer resin composition, ethylene-vinyl alcohol copolymer film formed therefrom, and multilayer structure containing the same

Ethylene-vinyl alcohol copolymer resin composition, ethylene-vinyl alcohol copolymer film formed therefrom, and multilayer structure containing the same

Ethylene-vinyl alcohol copolymer resin composition, ethylene-vinyl alcohol copolymer film formed therefrom, and multilayer structure containing the same

Ethylene-vinyl alcohol copolymer resin composition and multi-layer structure comprising thereof

Ethylene vinyl alcohol copolymer resin composition, ethylene vinyl alcohol copolymer film formed therefrom, and multilayer structure containing the same

Fluorine-containing ethylene-vinyl alcohol copolymer resin composition as well as mixture and blend thereof

ACER INC

Dip coating apparatus

Casing and manufacturing method of casing

Casing and manufacturing method thereof

Casing and manufacturing method thereof

Casing

Casing

ADVANCED SEMICONDUCTOR ENG

Semiconductor package structure and semiconductor process

Semiconductor package structure and semiconductor process

Semiconductor device package and a method of manufacturing the same

Semiconductor device package and a method of manufacturing the same

LIN WEN-HSIN

Automatic marking method for karaoke vocal accompaniment

Lactobacillus plantarum and uses thereof

EVEREST TEXTILE CO LTD

Composition of a water-repellent agent

WU BING-FEI

Intelligent driving assistant systems

AU OPTRONICS CORP

Backlight module and wire mounting assembly therefor

ASUSTEK COMP INC

Proximity sensor and mobile communication device thereof