P

Inventor

JIN JEONG-GI

KR11 patents
⚠️ This page may combine multiple inventors who share the name “JIN JEONG-GI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

7 patents
US10833032B2Nov 10, 2020

Semiconductor device

SAMSUNG ELECTRONICS CO LTD3 citations72
US10483224B2Nov 19, 2019

Semiconductor chip

SAMSUNG ELECTRONICS CO LTD1 citations72
US8987869B2Mar 24, 2015

Integrated circuit devices including through-silicon-vias having integral contact pads

SAMSUNG ELECTRONICS CO LTD4 citations72
US11798906B2Oct 24, 2023

Semiconductor chip

SAMSUNG ELECTRONICS CO LTD0 citations62
US11469202B2Oct 11, 2022

Semiconductor device

SAMSUNG ELECTRONICS CO LTD1 citations62
US11251144B2Feb 15, 2022

Semiconductor chip

SAMSUNG ELECTRONICS CO LTD0 citations62
US9240366B2Jan 19, 2016

Semiconductor device, semiconductor package, and electronic system

SAMSUNG ELECTRONICS CO LTD1 citations49

CHOI JU-IL

2 patents
US9735090B2Aug 15, 2017

Integrated circuit devices having through-silicon vias and methods of manufacturing such devices

CHOI JU-IL10 citations81
US9082680B2Jul 14, 2015

Joint structures having organic preservative films

CHOI JU-IL0 citations39

AMKOR TECHNOLOGY INC

1 patent
US7843072B1Nov 30, 2010

Semiconductor package having through holes

AMKOR TECHNOLOGY INC103 citations97

PARK JAE-HWA

1 patent
US9214411B2Dec 15, 2015

Integrated circuit devices including a through-silicon via structure and methods of fabricating the same

PARK JAE-HWA12 citations83