Inventor · disambiguated record

Keontaek Kang

Also filed as: KANG KEONTAEK

2 granted patents·11 citations·filing 2013–2013

52Inventor score

Technology areasH10W

Files withSTATS CHIPPAC LTD2

Top patents by PatentIndex Score

2 records

0186US9252130B2Methods of manufacturing flip chip semiconductor packages using double-sided thermal compression bondingSTATS CHIPPAC LTD·Filed 2013·Granted Feb 2, 2016·10 cites·27 claims
0259US9524958B2Semiconductor device and method of individual die bonding followed by simultaneous multiple die thermal compression bondingSTATS CHIPPAC LTD·Filed 2013·Granted Dec 20, 2016·1 cites·26 claims

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