Inventor
SENGUPTA SAMIT
US20 patents
⚠️ This page may combine multiple inventors who share the name “SENGUPTA SAMIT”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
QUALCOMM INC
5 patentsUS10490558B2Nov 26, 2019
Reducing or avoiding mechanical stress in static random access memory (SRAM) strap cells
QUALCOMM INC4 citations72
US10853542B1Dec 1, 2020
Fuse-based logic repair
QUALCOMM INC4 citations68
US9461040B2Oct 4, 2016
System and method of varying gate lengths of multiple cores
QUALCOMM INC0 citations51
US9076775B2Jul 7, 2015
System and method of varying gate lengths of multiple cores
QUALCOMM INC0 citations51
US9245971B2Jan 26, 2016
Semiconductor device having high mobility channel
QUALCOMM INC0 citations49
VLSI TECHNOLOGY INC
4 patentsUS5915203AJun 22, 1999
Method for producing deep submicron interconnect vias
VLSI TECHNOLOGY INC80 citations96
US6176983B1Jan 23, 2001
Methods of forming a semiconductor device
VLSI TECHNOLOGY INC32 citations92
US6057587AMay 2, 2000
Semiconductor device with anti-reflective structure
VLSI TECHNOLOGY INC37 citations92
US6207565B1Mar 27, 2001
Integrated process for ashing resist and treating silicon after masked spacer etch
VLSI TECHNOLOGY INC22 citations90
ALTERA CORP
3 patentsUS6933869B1Aug 23, 2005
Integrated circuits with temperature-change and threshold-voltage drift compensation
ALTERA CORP53 citations95
US7468617B1Dec 23, 2008
Electrostatic discharge (ESD) protection device for use with multiple I/O standards
ALTERA CORP12 citations83
US7286020B1Oct 23, 2007
Techniques for monitoring and replacing circuits to maintain high performance
ALTERA CORP10 citations79
PHILIPS ELECTRONICS NA
3 patentsUS6146996ANov 14, 2000
Semiconductor device with conductive via and method of making same
PHILIPS ELECTRONICS NA18 citations92
US6235609B1May 22, 2001
Method for forming isolation areas with improved isolation oxide
PHILIPS ELECTRONICS NA12 citations73
US6413152B1Jul 2, 2002
Apparatus for performing chemical-mechanical planarization with improved process window, process flexibility and cost
PHILIPS ELECTRONICS NA9 citations70