Inventor
POLLARD SCOTT CHRISTOPHER
US21 patents
⚠️ This page may combine multiple inventors who share the name “POLLARD SCOTT CHRISTOPHER”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CORNING INC
18 patentsUS9917045B2Mar 13, 2018
Methods and apparatus for providing an interposer for interconnecting semiconductor chips
CORNING INC6 citations82
US9472479B2Oct 18, 2016
Methods and apparatus for providing an interposer for interconnecting semiconductor chips
CORNING INC6 citations82
US12131985B2Oct 29, 2024
Hermetic metallized via with improved reliability
CORNING INC2 citations71
US11152294B2Oct 19, 2021
Hermetic metallized via with improved reliability
CORNING INC4 citations71
US11953462B2Apr 9, 2024
Glass electrochemical sensor with wafer level stacking and through glass via (TGV) interconnects
CORNING INC0 citations62
US11664285B2May 30, 2023
Electronic packages including structured glass articles and methods for making the same
CORNING INC0 citations62
US11630076B2Apr 18, 2023
Glass electrochemical sensor with wafer level stacking and through glass via (TGV) interconnects
CORNING INC0 citations62
US8053139B2Nov 8, 2011
SOFC thermal management via direct injection
CORNING INC2 citations62
US7687090B2Mar 30, 2010
Fuel cell device assembly and frame
CORNING INC5 citations62
US7416760B2Aug 26, 2008
Method of making a fuel cell device assembly and frame
CORNING INC2 citations62
US7279241B2Oct 9, 2007
Electrolyte sheet with a corrugation pattern
CORNING INC3 citations62
US11201109B2Dec 14, 2021
Hermetic metallized via with improved reliability
CORNING INC0 citations61
US12207405B2Jan 21, 2025
Beveled overburden for vias and method of making the same
CORNING INC0 citations60
US7282292B2Oct 16, 2007
Fuel cell stack assembly
CORNING INC3 citations60
US11709397B2Jul 25, 2023
Backlight including patterned reflectors, diffuser plate, and method for fabricating the backlight
CORNING INC1 citations57
US10932371B2Feb 23, 2021
Bottom-up electrolytic via plating method
CORNING INC0 citations50
US11171094B2Nov 9, 2021
Hermetic fully-filled metallized through-hole vias
CORNING INC0 citations48
US7803494B2Sep 28, 2010
Stress reducing mounting for electrolyte sheet assembly in a solid oxide fuel cell
CORNING INC1 citations47