Inventor
CHO BONGJU
KR19 patents
Patents
19 patentsUS11569175B2Jan 31, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD5 citations72
US11121079B2Sep 14, 2021
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations71
US11329014B2May 10, 2022
Semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations70
US12261105B2Mar 25, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations63
US12519051B2Jan 6, 2026
Semiconductor package device
SAMSUNG ELECTRONICS CO LTD0 citations62
US12394708B2Aug 19, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations62
US12278191B2Apr 15, 2025
Semiconductor packages having wiring patterns
SAMSUNG ELECTRONICS CO LTD0 citations62
US12046562B2Jul 23, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations62
US12021020B2Jun 25, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations62
US11562966B2Jan 24, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations62
US11569158B2Jan 31, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations61
US12119305B2Oct 15, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations60
US11935847B2Mar 19, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations60
US11837537B2Dec 5, 2023
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations60
US11398420B2Jul 26, 2022
Semiconductor package having core member and redistribution substrate
SAMSUNG ELECTRONICS CO LTD0 citations60
US12593684B2Mar 31, 2026
Semiconductor package including heat dissipation structure
SAMSUNG ELECTRONICS CO LTD0 citations51
US12057380B2Aug 6, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations51
US11721620B2Aug 8, 2023
Fan-out type semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations51
US12525526B2Jan 13, 2026
Semiconductor package and method of manufacturing the semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations49