Inventor
KANG MYUNGSAM
KR38 patents
Patents
38 patentsUS11581284B2Feb 14, 2023
Semiconductor package with under-bump metal structure
SAMSUNG ELECTRONICS CO LTD4 citations73
US11935849B2Mar 19, 2024
Semiconductor package with an antenna substrate
SAMSUNG ELECTRONICS CO LTD2 citations72
US11626367B2Apr 11, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD3 citations72
US11569175B2Jan 31, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD5 citations72
US11527495B2Dec 13, 2022
Semiconductor package with an antenna substrate
SAMSUNG ELECTRONICS CO LTD2 citations72
US11784129B2Oct 10, 2023
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD2 citations71
US11121079B2Sep 14, 2021
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations71
US11329014B2May 10, 2022
Semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations70
US12261105B2Mar 25, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations63
US12519051B2Jan 6, 2026
Semiconductor package device
SAMSUNG ELECTRONICS CO LTD0 citations62
US12394708B2Aug 19, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations62
US12334445B2Jun 17, 2025
Method of fabricating a semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations62
US12278191B2Apr 15, 2025
Semiconductor packages having wiring patterns
SAMSUNG ELECTRONICS CO LTD0 citations62
US12046562B2Jul 23, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations62
US12021020B2Jun 25, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations62
US12002798B2Jun 4, 2024
Fan-out type semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US11562966B2Jan 24, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations62
US11387225B2Jul 12, 2022
Fan-out type semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD1 citations62
US12183665B2Dec 31, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations61
US12094817B2Sep 17, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations61
US12062632B2Aug 13, 2024
Semiconductor package device
SAMSUNG ELECTRONICS CO LTD0 citations61
US12040297B2Jul 16, 2024
Methods of manufacturing semiconductor packages
SAMSUNG ELECTRONICS CO LTD0 citations61
US11916002B2Feb 27, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations61
US11676927B2Jun 13, 2023
Semiconductor package device
SAMSUNG ELECTRONICS CO LTD0 citations61
US11569158B2Jan 31, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations61
US12119305B2Oct 15, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations60
US11935847B2Mar 19, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations60
US11837537B2Dec 5, 2023
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations60
US11398420B2Jul 26, 2022
Semiconductor package having core member and redistribution substrate
SAMSUNG ELECTRONICS CO LTD0 citations60
US12593684B2Mar 31, 2026
Semiconductor package including heat dissipation structure
SAMSUNG ELECTRONICS CO LTD0 citations51
US12327826B2Jun 10, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations51
US12159826B2Dec 3, 2024
Semiconductor package and method of manufacturing the semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations51
US12057380B2Aug 6, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations51
US11804444B2Oct 31, 2023
Semiconductor package including heat dissipation structure
SAMSUNG ELECTRONICS CO LTD0 citations51
US11721620B2Aug 8, 2023
Fan-out type semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations51
US11538737B2Dec 27, 2022
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations51
US11508639B2Nov 22, 2022
System in package (SiP) semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations51
US11842950B2Dec 12, 2023
Package module
SAMSUNG ELECTRONICS CO LTD0 citations50