Inventor
LEE GUN
KR14 patents
⚠️ This page may combine multiple inventors who share the name “LEE GUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
10 patentsUS11121079B2Sep 14, 2021
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations71
US10790255B2Sep 29, 2020
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations71
US12154859B2Nov 26, 2024
Semiconductor package and method of manufacturing same
SAMSUNG ELECTRONICS CO LTD2 citations61
US10847474B2Nov 24, 2020
Semiconductor package and electromagnetic interference shielding structure for the same
SAMSUNG ELECTRONICS CO LTD1 citations61
US11837537B2Dec 5, 2023
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations60
US12568839B2Mar 3, 2026
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations50
US12463104B2Nov 4, 2025
Semiconductor package and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations50
US12341118B2Jun 24, 2025
Semiconductor package including an encapsulant
SAMSUNG ELECTRONICS CO LTD0 citations45
US11127692B2Sep 21, 2021
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations43
US12272666B2Apr 8, 2025
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations38