Inventor
LEE JAEKUL
KR9 patents
⚠️ This page may combine multiple inventors who share the name “LEE JAEKUL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
7 patentsUS11121079B2Sep 14, 2021
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations71
US11967578B2Apr 23, 2024
Semiconductor package including post
SAMSUNG ELECTRONICS CO LTD2 citations69
US12154840B2Nov 26, 2024
Semiconductor device and semiconductor package having the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US11670568B2Jun 6, 2023
Semiconductor device and semiconductor package having the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US11837537B2Dec 5, 2023
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations60
US12322720B2Jun 3, 2025
Semiconductor package including post
SAMSUNG ELECTRONICS CO LTD0 citations59
US11088060B2Aug 10, 2021
Package module including a plurality of electronic components and semiconductor chip(s) embedded in a single package
SAMSUNG ELECTRONICS CO LTD0 citations48