Inventor
ISHIHARA YOSUKE
JP17 patents
⚠️ This page may combine multiple inventors who share the name “ISHIHARA YOSUKE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
DENKA COMPANY LTD
11 patentsUS10358704B2Jul 23, 2019
Composite body and method for manufacturing same
DENKA COMPANY LTD5 citations71
US11912489B2Feb 27, 2024
Package accommodating heat dissipation substrate and packing box
DENKA COMPANY LTD0 citations62
US11903168B2Feb 13, 2024
Heat dissipation member
DENKA COMPANY LTD1 citations62
US11682604B2Jun 20, 2023
Heat dissipation component and method for manufacturing same
DENKA COMPANY LTD0 citations62
US10751912B2Aug 25, 2020
Aluminum-diamond-based composite and method for producing same
DENKA COMPANY LTD1 citations62
US10636723B2Apr 28, 2020
Heat dissipation component and method for manufacturing same
DENKA COMPANY LTD1 citations62
US10541189B2Jan 21, 2020
Heat dissipation component for semiconductor element
DENKA COMPANY LTD1 citations62
US10302375B2May 28, 2019
Aluminum-diamond composite, and heat dissipating component using same
DENKA COMPANY LTD1 citations61
US10640853B2May 5, 2020
Aluminum-diamond-based composite and heat dissipation component
DENKA COMPANY LTD1 citations59
US12303973B2May 20, 2025
Production method for aluminum-diamond composite
DENKA COMPANY LTD0 citations51
US10539379B2Jan 21, 2020
Heat dissipation component for semiconductor element
DENKA COMPANY LTD0 citations38
HIROTSURU HIDEKI
3 patentsUS8890189B2Nov 18, 2014
Wafer for LED mounting, method for manufacturing same, and LED-mounted structure using the wafer
HIROTSURU HIDEKI2 citations61
US9524918B2Dec 20, 2016
Heat dissipating component for semiconductor element
HIROTSURU HIDEKI0 citations51
US9387532B2Jul 12, 2016
Composite substrate for LED light emitting element, method of production of same, and LED light emitting element
HIROTSURU HIDEKI0 citations51