Inventor
KUNIMUNE TEPPEI
JP12 patents
⚠️ This page may combine multiple inventors who share the name “KUNIMUNE TEPPEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NICHIA CORP
11 patentsUS10941304B2Mar 9, 2021
Metal powder sintering paste and method of producing the same, and method of producing conductive material
NICHIA CORP3 citations71
US12571519B2Mar 10, 2026
Wavelength conversion module, light emission device, and method for manufacturing wavelength conversion module
NICHIA CORP0 citations61
US12447528B2Oct 21, 2025
Resin impregnation method, method of manufacturing wavelength-conversion module, and wavelength-conversion module
NICHIA CORP0 citations61
US12125607B2Oct 22, 2024
Metal powder sintering paste and method of producing the same, and method of producing conductive material
NICHIA CORP0 citations61
US11752551B2Sep 12, 2023
Resin impregnation method, method of manufacturing wavelength-conversion module, and wavelength-conversion module
NICHIA CORP0 citations61
US11739238B2Aug 29, 2023
Electrically conductive adhesive and electrically conductive material
NICHIA CORP0 citations61
US11634596B2Apr 25, 2023
Metal powder sintering paste and method of producing the same, and method of producing conductive material
NICHIA CORP0 citations61
US11162004B2Nov 2, 2021
Electrically conductive adhesive and electrically conductive material
NICHIA CORP0 citations61
US10707388B2Jul 7, 2020
Semiconductor device, and method for manufacturing semiconductor device
NICHIA CORP0 citations51
US10593851B2Mar 17, 2020
Metal powder sintering paste, method for producing the same, and method for producing conductive material
NICHIA CORP0 citations51
US10875127B2Dec 29, 2020
Method for bonding electronic component and method for manufacturing bonded body
NICHIA CORP0 citations49