Inventor
TAKAHASHI NAOTOMI
JP16 patents
Patents
16 patentsUS6660406B2Dec 9, 2003
Method for manufacturing printed wiring board comprising electrodeposited copper foil with carrier and resistor circuit; and printed wiring board comprising resistor circuit
MITSUI MINING & SMELTING CO26 citations92
US6605369B1Aug 12, 2003
Surface-treated copper foil and method for producing the same
MITSUI MINING & SMELTING CO19 citations92
US4640747AFeb 3, 1987
Process for surface treatment of copper product
MITSUI MINING & SMELTING CO29 citations89
US6839219B2Jan 4, 2005
Laminate for forming capacitor layer and method for manufacturing the same
MITSUI MINING & SMELTING CO21 citations87
US6649274B1Nov 18, 2003
Electrolytic copper foil with carrier foil and copper-clad laminate using the electrolytic copper foil with carrier foil
MITSUI MINING & SMELTING CO13 citations82
US6902824B2Jun 7, 2005
Copper foil and metal foil with carrier foil for printed wiring board, and semi-additive process for producing printed wiring board using the same
MITSUI MINING & SMELTING CO9 citations74
US6478247B2Nov 12, 2002
Method for winding copper foil on core tube
MITSUI MINING & SMELTING CO11 citations72
US6322904B1Nov 27, 2001
Copper foil for printed circuit boards
MITSUI MINING & SMELTING CO13 citations72
US6544664B1Apr 8, 2003
Copper foil for printed wiring board
MITSUI MINING & SMELTING CO12 citations71
US6716572B2Apr 6, 2004
Manufacturing process for printed wiring board
MITSUI MINING & SMELTING CO5 citations63
US6585877B2Jul 1, 2003
Method of producing a surface-treated copper foil
MITSUI MINING & SMELTING CO4 citations63
US6579437B2Jun 17, 2003
Method of producing a surface-treated copper foil
MITSUI MINING & SMELTING CO3 citations63
US6533915B2Mar 18, 2003
Surface-treated copper foil, method of producing the surface-treated copper foil, and copper-clad laminate employing the surface-treated copper foil
MITSUI MINING & SMELTING CO4 citations63
US6531045B2Mar 11, 2003
Surface-treated copper foil, method of producing the surface-treated copper foil, and copper-clad laminate employing the surface-treated copper foil
MITSUI MINING & SMELTING CO2 citations63
US6479170B2Nov 12, 2002
Electrodeposited copper foil, method of inspecting physical properties thereof, and copper-clad laminate employing the electrodeposited copper foil
MITSUI MINING & SMELTING CO5 citations62
US6616827B2Sep 9, 2003
Filtration method of copper electrolyte
MITSUI MINING & SMELTING CO5 citations57