Inventor

LI JENG-JEN

TW11 patents

⚠️ This page may combine multiple inventors who share the name “LI JENG-JEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CYNTEC CO LTD

3 patents

US7405467B2Jul 29, 2008

Power module package structure

CYNTEC CO LTD15 citations83

US10373894B2Aug 6, 2019

Package structure and the method to fabricate thereof

CYNTEC CO LTD0 citations49

US9484290B2Nov 1, 2016

Electronic system with a composite substrate

CYNTEC CO LTD1 citations48

LEE HAN-HSIANG

2 patents

US8619428B2Dec 31, 2013

Electronic package structure

LEE HAN-HSIANG4 citations59

US8547709B2Oct 1, 2013

Electronic system with a composite substrate

LEE HAN-HSIANG0 citations47

IND TECH RES INST

1 patent

US6383048B1May 7, 2002

Packaging method for organic polymer EL displays

IND TECH RES INST36 citations89

LU BAU-RU

1 patent

US9536798B2Jan 3, 2017

Package structure and the method to fabricate thereof

LU BAU-RU2 citations69

CHEN DA-JUNG

1 patent

US8253041B2Aug 28, 2012

Electronic element packaging module

CHEN DA-JUNG1 citations44

HUANG CHI-FENG

1 patent

US9386686B2Jul 5, 2016

Metal core printed circuit board and electronic package structure

HUANG CHI-FENG0 citations40

LU BAU RU

1 patent

US10636735B2Apr 28, 2020

Package structure and the method to fabricate thereof

LU BAU RU0 citations39

LI JENG JEN

1 patent

US10373930B2Aug 6, 2019

Package structure and the method to fabricate thereof

LI JENG JEN0 citations33