Inventor

BIGGS JULIE C

US4 patents

⚠️ This page may combine multiple inventors who share the name “BIGGS JULIE C”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IBM

3 patents

US6995475B2Feb 7, 2006

I/C chip suitable for wire bonding

IBM9 citations73

US7473997B2Jan 6, 2009

Method for forming robust solder interconnect structures by reducing effects of seed layer underetching

IBM4 citations62

US7572726B2Aug 11, 2009

Method of forming a bond pad on an I/C chip and resulting structure

IBM0 citations51

TESSERA INTELLECTUAL PROPERTIE

1 patent

US7767575B2Aug 3, 2010

Forming robust solder interconnect structures by reducing effects of seed layer underetching

TESSERA INTELLECTUAL PROPERTIE0 citations42