Inventor
EICHSTADT DAVID E
US13 patents
⚠️ This page may combine multiple inventors who share the name “EICHSTADT DAVID E”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
9 patentsUS7144490B2Dec 5, 2006
Method for selective electroplating of semiconductor device I/O pads using a titanium-tungsten seed layer
IBM14 citations84
US7566649B2Jul 28, 2009
Compressible films surrounding solder connectors
IBM8 citations83
US6995475B2Feb 7, 2006
I/C chip suitable for wire bonding
IBM9 citations73
US7332821B2Feb 19, 2008
Compressible films surrounding solder connectors
IBM7 citations72
US7473997B2Jan 6, 2009
Method for forming robust solder interconnect structures by reducing effects of seed layer underetching
IBM4 citations62
US7316572B2Jan 8, 2008
Compliant electrical contacts
IBM6 citations62
US6992389B2Jan 31, 2006
Barrier for interconnect and method
IBM4 citations61
US7572726B2Aug 11, 2009
Method of forming a bond pad on an I/C chip and resulting structure
IBM0 citations51
US6900142B2May 31, 2005
Inhibition of tin oxide formation in lead free interconnect formation
IBM1 citations46
DTL LINEAR LLC
3 patentsUS12031851B2Jul 9, 2024
Actuator apparatus with light actuated position sensor and secure position verification
DTL LINEAR LLC3 citations68
US12515715B2Jan 6, 2026
Actuator apparatus with precision bearings and light sensor
DTL LINEAR LLC0 citations56
US12416513B2Sep 16, 2025
Actuator apparatus with light actuated position sensor and secure position verification
DTL LINEAR LLC0 citations56