Inventor
OGURA ICHIROU
JP11 patents
⚠️ This page may combine multiple inventors who share the name “OGURA ICHIROU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
OGURA ICHIROU
4 patentsUS8084567B2Dec 27, 2011
Epoxy resin composition and cured article thereof, novel epoxy resin and production method thereof, and novel phenol resin
OGURA ICHIROU3 citations60
US8440781B2May 14, 2013
Epdxy resin composition and cured article thereof, semiconductor encapsulation material, novel phenol resin, and novel epdoxy resin
OGURA ICHIROU0 citations50
US8420749B2Apr 16, 2013
Epoxy resin composition and cured article thereof, semiconductor encapsulation material, novel phenol resin, and novel epoxy resin
OGURA ICHIROU0 citations50
US8703845B2Apr 22, 2014
Curable resin composition, cured product thereof, phenolic resin, epoxy resin, and semiconductor sealing material
OGURA ICHIROU0 citations34
KOBAYASHI ATSUKO
2 patentsUS8487052B2Jul 16, 2013
Resin composition for fiber-reinforced composite material, cured product thereof, fiber-reinforced composite material, molding of fiber-reinforced resin, and process for production thereof
KOBAYASHI ATSUKO7 citations81
US8883938B2Nov 11, 2014
Resin composition for fiber-reinforced composite material, cured product thereof, fiber-reinforced composite material, molding of fiber-reinforced resin, and process for production thereof
KOBAYASHI ATSUKO4 citations70
SATOU YUTAKA
2 patentsUS8168731B2May 1, 2012
Curable resin composition, cured product thereof, printed wiring board, epoxy resin, and process for producing the same
SATOU YUTAKA4 citations59
US8394911B2Mar 12, 2013
Phenol resin composition, production method therefor, curable resin composition, cured product thereof, and printed circuit board
SATOU YUTAKA0 citations38