Inventor

LIU FUHAN

US4 patents

⚠️ This page may combine multiple inventors who share the name “LIU FUHAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIU FUHAN

1 patent

US8536695B2Sep 17, 2013

Chip-last embedded interconnect structures

LIU FUHAN57 citations93

SUNDARAM VENKATESH

1 patent

US9275934B2Mar 1, 2016

Through-package-via (TPV) structures on inorganic interposer and methods for fabricating same

SUNDARAM VENKATESH43 citations88

GEORGIA TECH RES INST

1 patent

US10672718B2Jun 2, 2020

Through-package-via (TPV) structures on inorganic interposer and methods for fabricating same

GEORGIA TECH RES INST6 citations81

MCGREGOR DAVID ROSS

1 patent

US8391017B2Mar 5, 2013

Thin-film capacitor structures embedded in semiconductor packages and methods of making

MCGREGOR DAVID ROSS5 citations62