Inventor

SUKUMARAN VIJAY

US6 patents

⚠️ This page may combine multiple inventors who share the name “SUKUMARAN VIJAY”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

GLOBALFOUNDRIES INC

4 patents

US9805977B1Oct 31, 2017

Integrated circuit structure having through-silicon via and method of forming same

GLOBALFOUNDRIES INC16 citations80

US10090255B2Oct 2, 2018

SUNDARAM VENKATESH

1 patent

US9275934B2Mar 1, 2016

Through-package-via (TPV) structures on inorganic interposer and methods for fabricating same

SUNDARAM VENKATESH43 citations88

GEORGIA TECH RES INST

1 patent

US10672718B2Jun 2, 2020

Through-package-via (TPV) structures on inorganic interposer and methods for fabricating same

GEORGIA TECH RES INST6 citations81

SUKUMARAN VIJAY

GLOBALFOUNDRIES INC

Integrated circuit structure having through-silicon via and method of forming same

Dicing channels for glass interposers

Crack prevent and stop for thin glass substrates

Crack prevent and stop for thin glass substrates

SUNDARAM VENKATESH

Through-package-via (TPV) structures on inorganic interposer and methods for fabricating same

GEORGIA TECH RES INST

Through-package-via (TPV) structures on inorganic interposer and methods for fabricating same