Inventor
HOOPER STEPHEN R
US48 patents
⚠️ This page may combine multiple inventors who share the name “HOOPER STEPHEN R”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FREESCALE SEMICONDUCTOR INC
20 patentsUS7109055B2Sep 19, 2006
Methods and apparatus having wafer level chip scale package for sensing elements
FREESCALE SEMICONDUCTOR INC60 citations95
US10053359B2Aug 21, 2018
Microelectronic packages having axially-partitioned hermetic cavities and methods for the fabrication thereof
FREESCALE SEMICONDUCTOR INC35 citations94
US8359927B2Jan 29, 2013
Molded differential PRT pressure sensor
FREESCALE SEMICONDUCTOR INC41 citations94
US7900521B2Mar 8, 2011
Exposed pad backside pressure sensor package
FREESCALE SEMICONDUCTOR INC28 citations92
US7632698B2Dec 15, 2009
Integrated circuit encapsulation and method therefor
FREESCALE SEMICONDUCTOR INC16 citations88
US9470652B1Oct 18, 2016
Sensing field effect transistor devices and method of their manufacture
FREESCALE SEMICONDUCTOR INC9 citations84
US9165886B2Oct 20, 2015
Sensor packaging method and sensor packages
FREESCALE SEMICONDUCTOR INC15 citations84
US7316965B2Jan 8, 2008
Substrate contact for a capped MEMS and method of making the substrate contact at the wafer level
FREESCALE SEMICONDUCTOR INC13 citations83
US8384168B2Feb 26, 2013
Sensor device with sealing structure
FREESCALE SEMICONDUCTOR INC8 citations82
US7834431B2Nov 16, 2010
Leadframe for packaged electronic device with enhanced mold locking capability
FREESCALE SEMICONDUCTOR INC15 citations79
US9663350B2May 30, 2017
Stress isolated differential pressure sensor
FREESCALE SEMICONDUCTOR INC4 citations73
US9446940B2Sep 20, 2016
Stress isolation for MEMS device
FREESCALE SEMICONDUCTOR INC6 citations73
US9598280B2Mar 21, 2017
Environmental sensor structure
FREESCALE SEMICONDUCTOR INC2 citations71
US9455216B2Sep 27, 2016
Semiconductor device package and method of manufacture
FREESCALE SEMICONDUCTOR INC2 citations62
US9376310B2Jun 28, 2016
Microelectronic packages having stacked accelerometer and magnetometer die and methods for the production thereof
FREESCALE SEMICONDUCTOR INC2 citations62
US9346671B2May 24, 2016
Shielding MEMS structures during wafer dicing
FREESCALE SEMICONDUCTOR INC2 citations62
US9227838B2Jan 5, 2016
Cavity-type semiconductor package and method of packaging same
FREESCALE SEMICONDUCTOR INC2 citations62
US9093436B2Jul 28, 2015
Semiconductor device package and method of manufacture
FREESCALE SEMICONDUCTOR INC0 citations51
US7528468B2May 5, 2009
Capacitor assembly with shielded connections and method for forming the same
FREESCALE SEMICONDUCTOR INC0 citations51
US7859068B2Dec 28, 2010
Integrated circuit encapsulation and method therefor
FREESCALE SEMICONDUCTOR INC0 citations47
BOWLES PHILIP H
11 patentsUS9499397B2Nov 22, 2016
Microelectronic packages having axially-partitioned hermetic cavities and methods for the fabrication thereof
BOWLES PHILIP H49 citations97
US9108841B1Aug 18, 2015
Microelectronic packages having stacked accelerometer and magnetometer die and methods for the production thereof
BOWLES PHILIP H23 citations92
US8659167B1Feb 25, 2014
Sensor packaging method and sensor packages
BOWLES PHILIP H11 citations83
US9018029B1Apr 28, 2015
Vent hole sealing in multiple die sensor device
BOWLES PHILIP H4 citations73
US9365414B2Jun 14, 2016
Sensor package having stacked die
BOWLES PHILIP H4 citations72
US9090454B2Jul 28, 2015
Sequential wafer bonding
BOWLES PHILIP H2 citations62
US9040355B2May 26, 2015
Sensor package and method of forming same
BOWLES PHILIP H3 citations62
US10442685B2Oct 15, 2019
Microelectronic packages having hermetic cavities and methods for the production thereof
BOWLES PHILIP H0 citations51
US9604844B2Mar 28, 2017
Sequential wafer bonding
BOWLES PHILIP H0 citations51
US8884413B2Nov 11, 2014
Leadframes, air-cavity packages, and electronic devices with offset vent holes, and methods of their manufacture
BOWLES PHILIP H0 citations51
US9891244B2Feb 13, 2018
Microelectronic packages having split gyroscope structures and methods for the fabrication thereof
BOWLES PHILIP H0 citations41
HOOPER STEPHEN R
9 patentsUS8307714B1Nov 13, 2012
Dual port pressure sensor
HOOPER STEPHEN R7 citations83
US8476087B2Jul 2, 2013
Methods for fabricating sensor device package using a sealing structure
HOOPER STEPHEN R14 citations82
US8906747B2Dec 9, 2014
Cavity-type semiconductor package and method of packaging same
HOOPER STEPHEN R4 citations72
US9638597B2May 2, 2017
Differential pressure sensor assembly
HOOPER STEPHEN R6 citations67
US8890308B2Nov 18, 2014
Integrated circuit package and method of forming the same
HOOPER STEPHEN R2 citations57
US9676611B2Jun 13, 2017
Sensor device packages and related fabrication methods
HOOPER STEPHEN R1 citations51
US9093739B2Jul 28, 2015
Device including an antenna and method of using an antenna
HOOPER STEPHEN R0 citations51
US9021689B2May 5, 2015
Method of making a dual port pressure sensor
HOOPER STEPHEN R1 citations51
US9510495B2Nov 29, 2016
Electronic devices with cavity-type, permeable material filled packages, and methods of their manufacture
HOOPER STEPHEN R1 citations48