Inventor
HSIEH CHIN-TANG
TW28 patents
⚠️ This page may combine multiple inventors who share the name “HSIEH CHIN-TANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CHIPBOND TECHNOLOGY CORP
16 patentsUS10580729B2Mar 3, 2020
Chip on film package and flexible substrate thereof
CHIPBOND TECHNOLOGY CORP4 citations73
US12424551B2Sep 23, 2025
Semiconductor structure and method of manufacturing the same
CHIPBOND TECHNOLOGY CORP0 citations61
US8981536B1Mar 17, 2015
Semiconductor structure
CHIPBOND TECHNOLOGY CORP3 citations59
US10797213B2Oct 6, 2020
Chip package and chip thereof
CHIPBOND TECHNOLOGY CORP0 citations51
US10327334B1Jun 18, 2019
Layout structure of flexible circuit board
CHIPBOND TECHNOLOGY CORP0 citations51
US8841767B2Sep 23, 2014
Bumping process and structure thereof
CHIPBOND TECHNOLOGY CORP0 citations51
US8476159B2Jul 2, 2013
Substrate structure with compliant bump and manufacturing method thereof
CHIPBOND TECHNOLOGY CORP0 citations51
US9961759B2May 1, 2018
Flexible substrate
CHIPBOND TECHNOLOGY CORP0 citations50
US12543581B2Feb 3, 2026
Flip-chip bonding structure and substrate thereof
CHIPBOND TECHNOLOGY CORP0 citations48
US9159660B2Oct 13, 2015
Semiconductor package structure and method for making the same
CHIPBOND TECHNOLOGY CORP0 citations48
US9059260B2Jun 16, 2015
Semiconductor manufacturing method and semiconductor structure thereof
CHIPBOND TECHNOLOGY CORP0 citations48
US8823169B2Sep 2, 2014
Semiconductor manufacturing method and semiconductor structure thereof
CHIPBOND TECHNOLOGY CORP1 citations48
US12538805B2Jan 27, 2026
Semiconductor package and method of manufacturing the same
CHIPBOND TECHNOLOGY CORP0 citations46
US10504828B2Dec 10, 2019
Semiconductor package and circuit substrate thereof
CHIPBOND TECHNOLOGY CORP0 citations41
US9000569B2Apr 7, 2015
Semiconductor structure
CHIPBOND TECHNOLOGY CORP0 citations38
US8796824B1Aug 5, 2014
Semiconductor structure
CHIPBOND TECHNOLOGY CORP0 citations38
HSIEH CHIN-TANG
6 patentsUS8450203B2May 28, 2013
Bumping process and structure thereof
HSIEH CHIN-TANG2 citations61
US8658466B2Feb 25, 2014
Semiconductor package structure and method for making the same
HSIEH CHIN-TANG2 citations58
US8497571B2Jul 30, 2013
Thin flip chip package structure
HSIEH CHIN-TANG2 citations56
US8426984B2Apr 23, 2013
Substrate structure with compliant bump and manufacturing method thereof
HSIEH CHIN-TANG0 citations51
US8471372B2Jun 25, 2013
Thin flip chip package structure
HSIEH CHIN-TANG0 citations45
US8581384B2Nov 12, 2013
Semiconductor package structure
HSIEH CHIN-TANG0 citations38