Inventor
CHO BEOM JOON
KR48 patents
⚠️ This page may combine multiple inventors who share the name “CHO BEOM JOON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRO MECH
42 patentsUS11848159B2Dec 19, 2023
Multilayer capacitor and board for mounting the same
SAMSUNG ELECTRO MECH4 citations74
US11164699B2Nov 2, 2021
Electronic component
SAMSUNG ELECTRO MECH2 citations73
US10770236B2Sep 8, 2020
Multilayer ceramic electronic component array
SAMSUNG ELECTRO MECH2 citations73
US10796853B2Oct 6, 2020
Electronic component
SAMSUNG ELECTRO MECH3 citations72
US12322557B2Jun 3, 2025
Electronic component and board having the same mounted thereon
SAMSUNG ELECTRO MECH0 citations62
US11948750B2Apr 2, 2024
Electronic component
SAMSUNG ELECTRO MECH0 citations62
US11355288B2Jun 7, 2022
Electronic component and board having the same mounted thereon
SAMSUNG ELECTRO MECH0 citations62
US11302481B2Apr 12, 2022
Electronic component and substrate having the same mounted thereon
SAMSUNG ELECTRO MECH0 citations62
US10529496B1Jan 7, 2020
Electronic component including a capacitor array
SAMSUNG ELECTRO MECH1 citations62
US7951446B2May 31, 2011
Constraining green sheet and manufacturing method of multi-layer ceramic substrate
SAMSUNG ELECTRO MECH2 citations61
US7994084B2Aug 9, 2011
Dielectric composition and multilayer ceramic capacitor embedded low temperature co-fired ceramic substrate using the same
SAMSUNG ELECTRO MECH4 citations60
US11837404B2Dec 5, 2023
Electronic component
SAMSUNG ELECTRO MECH0 citations59
US11587729B2Feb 21, 2023
Electronic component
SAMSUNG ELECTRO MECH1 citations59
US11515096B2Nov 29, 2022
Electronic component
SAMSUNG ELECTRO MECH0 citations59
US11393624B2Jul 19, 2022
Electronic component and board having the same mounted thereon
SAMSUNG ELECTRO MECH0 citations59
US12087512B2Sep 10, 2024
Electronic component and board having the same
SAMSUNG ELECTRO MECH0 citations58
US11749460B2Sep 5, 2023
Electronic component and board having the same
SAMSUNG ELECTRO MECH0 citations58
US11688561B2Jun 27, 2023
Electronic component having metal frame for preventing sparking and short circuits and board having the same
SAMSUNG ELECTRO MECH0 citations54
US11581135B2Feb 14, 2023
Electronic component and board having the same mounted thereon
SAMSUNG ELECTRO MECH0 citations54
US11728095B2Aug 15, 2023
Electronic component
SAMSUNG ELECTRO MECH0 citations53
US12542237B2Feb 3, 2026
Multilayer electronic component
SAMSUNG ELECTRO MECH0 citations52
US12394569B2Aug 19, 2025
Multilayer capacitor
SAMSUNG ELECTRO MECH0 citations52
US11276529B2Mar 15, 2022
Electronic component and board having the same mounted thereon
SAMSUNG ELECTRO MECH0 citations52
US11004613B2May 11, 2021
Multilayer capacitor
SAMSUNG ELECTRO MECH0 citations52
US10984954B2Apr 20, 2021
Capacitor array
SAMSUNG ELECTRO MECH0 citations52
US10861648B2Dec 8, 2020
Electronic component
SAMSUNG ELECTRO MECH0 citations52
US10854389B2Dec 1, 2020
Electronic component
SAMSUNG ELECTRO MECH0 citations52
US10636571B2Apr 28, 2020
Electronic component
SAMSUNG ELECTRO MECH0 citations52
US10636570B2Apr 28, 2020
Electronic component
SAMSUNG ELECTRO MECH0 citations52
US10515761B1Dec 24, 2019
Electronic component including a capacitor array
SAMSUNG ELECTRO MECH0 citations52
US7887905B2Feb 15, 2011
Constraining green sheet and manufacturing method of multi-layer ceramic substrate using the same
SAMSUNG ELECTRO MECH0 citations51
US10971304B2Apr 6, 2021
Electronic component having metal frames
SAMSUNG ELECTRO MECH0 citations50
US10886071B2Jan 5, 2021
Electronic component
SAMSUNG ELECTRO MECH0 citations50
US11721481B2Aug 8, 2023
Electronic component
SAMSUNG ELECTRO MECH0 citations49
US9681551B2Jun 13, 2017
Low temperature co-fired ceramic substrate with embeded capacitors
SAMSUNG ELECTRO MECH0 citations45
US11594376B2Feb 28, 2023
Electronic component and board having the same mounted thereon
SAMSUNG ELECTRO MECH0 citations44
US11640876B2May 2, 2023
Electronic component
SAMSUNG ELECTRO MECH0 citations43
US10879003B2Dec 29, 2020
Electronic component having metal frames for mounting
SAMSUNG ELECTRO MECH0 citations42
US10840019B2Nov 17, 2020
Electronic component
SAMSUNG ELECTRO MECH0 citations42
US10879007B2Dec 29, 2020
Electronic component
SAMSUNG ELECTRO MECH0 citations41
US10734161B2Aug 4, 2020
Multilayer electronic component and board having the same
SAMSUNG ELECTRO MECH0 citations41
US10650975B2May 12, 2020
Multilayer electronic component
SAMSUNG ELECTRO MECH0 citations41
CHO BEOM JOON
5 patentsUS8182904B2May 22, 2012
Laminated ceramic package
CHO BEOM JOON0 citations50
US8153259B2Apr 10, 2012
Ceramic sheet product and method of manufacturing the same
CHO BEOM JOON0 citations50
US8637143B2Jan 28, 2014
LTCC composition, LTCC substrate comprising the same and method of manufacturing the same
CHO BEOM JOON0 citations49
US8753462B2Jun 17, 2014
Method of manufacturing non-shrinking multilayer ceramic substrate
CHO BEOM JOON0 citations39
US8178193B2May 15, 2012
Constraining green sheet and method of manufacturing multi-layer ceramic substrate using the same
CHO BEOM JOON0 citations39