Inventor
SHIN WOO CHUL
KR110 patents
⚠️ This page may combine multiple inventors who share the name “SHIN WOO CHUL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRO MECH
49 patentsUS10361035B1Jul 23, 2019
Multilayer ceramic electronic component
SAMSUNG ELECTRO MECH27 citations94
US10325723B1Jun 18, 2019
Electronic component
SAMSUNG ELECTRO MECH20 citations94
US10395840B1Aug 27, 2019
Multilayer ceramic electronic component
SAMSUNG ELECTRO MECH27 citations93
US11170936B2Nov 9, 2021
Multilayer ceramic capacitor and method of manufacturing the same
SAMSUNG ELECTRO MECH9 citations86
US10446323B1Oct 15, 2019
Electronic component having multilayer capacitor, interposer, and adhesive layer
SAMSUNG ELECTRO MECH16 citations86
US11501922B2Nov 15, 2022
Multilayer electronic component for enhanced moisture resistance and bending strength
SAMSUNG ELECTRO MECH6 citations85
US11183332B2Nov 23, 2021
Multilayer electronic component
SAMSUNG ELECTRO MECH14 citations85
US11158455B2Oct 26, 2021
Electronic component having body with exposed lower portion
SAMSUNG ELECTRO MECH6 citations84
US10483040B1Nov 19, 2019
Electronic component
SAMSUNG ELECTRO MECH11 citations84
US10366839B1Jul 30, 2019
Electronic component
SAMSUNG ELECTRO MECH8 citations84
US11037727B2Jun 15, 2021
Multilayer electronic component
SAMSUNG ELECTRO MECH6 citations83
US10354802B1Jul 16, 2019
Ceramic electronic component
SAMSUNG ELECTRO MECH19 citations83
US7843619B1Nov 30, 2010
Scanner motor
SAMSUNG ELECTRO MECH11 citations81
US11600443B2Mar 7, 2023
Multilayer electronic component
SAMSUNG ELECTRO MECH4 citations74
US11670451B2Jun 6, 2023
Multilayer ceramic capacitor
SAMSUNG ELECTRO MECH1 citations73
US11657976B2May 23, 2023
Capacitor component including reinforcing pattern in a margin/cover portion
SAMSUNG ELECTRO MECH2 citations73
US11527358B2Dec 13, 2022
Multilayer ceramic capacitor
SAMSUNG ELECTRO MECH2 citations73
US11380488B2Jul 5, 2022
Multilayer electronic component for enhanced moisture resistance and bending strength
SAMSUNG ELECTRO MECH4 citations73
US11348727B2May 31, 2022
Multilayer ceramic capacitor
SAMSUNG ELECTRO MECH2 citations73
US11250992B2Feb 15, 2022
Capacitor component
SAMSUNG ELECTRO MECH2 citations73
US11177072B2Nov 16, 2021
Multilayer capacitor and board having the same mounted thereon
SAMSUNG ELECTRO MECH3 citations73
US11164699B2Nov 2, 2021
Electronic component
SAMSUNG ELECTRO MECH2 citations73
US11043333B2Jun 22, 2021
Composite electronic component
SAMSUNG ELECTRO MECH2 citations73
US10978251B2Apr 13, 2021
Multilayer ceramic electronic component
SAMSUNG ELECTRO MECH3 citations73
US10957486B2Mar 23, 2021
Electronic component
SAMSUNG ELECTRO MECH3 citations73
US10923282B2Feb 16, 2021
Electronic component
SAMSUNG ELECTRO MECH4 citations73
US10910155B2Feb 2, 2021
Electronic component
SAMSUNG ELECTRO MECH2 citations73
US10879006B2Dec 29, 2020
Multilayer ceramic electronic component
SAMSUNG ELECTRO MECH2 citations73
US10879000B2Dec 29, 2020
Multilayer ceramic electronic component and interposer included therein
SAMSUNG ELECTRO MECH3 citations73
US10832869B2Nov 10, 2020
Multilayer electronic component
SAMSUNG ELECTRO MECH3 citations73
US10784047B2Sep 22, 2020
Multilayer ceramic electronic component
SAMSUNG ELECTRO MECH4 citations73
US10770236B2Sep 8, 2020
Multilayer ceramic electronic component array
SAMSUNG ELECTRO MECH2 citations73
US10672562B2Jun 2, 2020
Electronic component
SAMSUNG ELECTRO MECH4 citations73
US10553362B1Feb 4, 2020
Multilayer ceramic electronic component and interposer included therein
SAMSUNG ELECTRO MECH5 citations73
US10468195B1Nov 5, 2019
Multilayer ceramic electronic component array
SAMSUNG ELECTRO MECH4 citations73
US11721480B2Aug 8, 2023
Multilayer electronic component
SAMSUNG ELECTRO MECH1 citations72
US11450481B2Sep 20, 2022
Multilayer electronic component
SAMSUNG ELECTRO MECH3 citations72
US11289270B2Mar 29, 2022
Multilayer electronic component
SAMSUNG ELECTRO MECH1 citations72
US10395839B1Aug 27, 2019
Multilayer ceramic electronic component
SAMSUNG ELECTRO MECH5 citations72
US11527363B2Dec 13, 2022
Multilayer ceramic electronic component
SAMSUNG ELECTRO MECH2 citations71
US11158458B2Oct 26, 2021
Multi-layered ceramic electronic component and manufacturing method thereof
SAMSUNG ELECTRO MECH2 citations71
US11081281B2Aug 3, 2021
Multilayer ceramic electronic component
SAMSUNG ELECTRO MECH6 citations71
US12205772B2Jan 21, 2025
Multilayer capacitor and substrate including the same mounted thereon
SAMSUNG ELECTRO MECH0 citations63
US12136523B2Nov 5, 2024
Multilayer capacitor and board having the same mounted thereon
SAMSUNG ELECTRO MECH0 citations63
US11961673B2Apr 16, 2024
Multilayer ceramic capacitor
SAMSUNG ELECTRO MECH0 citations63
US11875948B2Jan 16, 2024
Multilayer capacitor and substrate including the same mounted thereon
SAMSUNG ELECTRO MECH0 citations63
US11784007B2Oct 10, 2023
Capacitor component including reinforcing pattern in a margin/cover portion
SAMSUNG ELECTRO MECH0 citations63
US11763986B2Sep 19, 2023
Electronic component including insulating layer between body and shielding layer
SAMSUNG ELECTRO MECH0 citations63
US11651897B2May 16, 2023
Electronic component
SAMSUNG ELECTRO MECH0 citations63
SAMSUNG ELECTRONICS CO LTD
1 patentShowing the top 50 of 110 patents by PatentIndex Score.