Inventor
LEE JONG GI
KR24 patents
⚠️ This page may combine multiple inventors who share the name “LEE JONG GI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRO MECH
13 patentsUS12061316B2Aug 13, 2024
Optical imaging system
SAMSUNG ELECTRO MECH2 citations72
US12554102B2Feb 17, 2026
Imaging lens system
SAMSUNG ELECTRO MECH0 citations62
US12189092B2Jan 7, 2025
Optical imaging system including six lenses of +−−−++, or seven lenses of −−+−++−, +−+−−+ +, −++−+−− or −++−++− refractive powers
SAMSUNG ELECTRO MECH0 citations62
US11966015B2Apr 23, 2024
Optical imaging system
SAMSUNG ELECTRO MECH0 citations62
US11940599B2Mar 26, 2024
Optical imaging system
SAMSUNG ELECTRO MECH0 citations62
US11803034B2Oct 31, 2023
Optical imaging system including six lenses of +---++, or seven lenses of --+-++-, +-+--++, -++-+-- or -++-++- refractive powers
SAMSUNG ELECTRO MECH0 citations62
US11782241B2Oct 10, 2023
Imaging lens system including eight lenses of ++−+−−+−, ++−+−+−− or ++−+−++− refractive powers
SAMSUNG ELECTRO MECH0 citations62
US10901184B2Jan 26, 2021
Optical imaging system
SAMSUNG ELECTRO MECH0 citations62
US11640100B2May 2, 2023
Camera module
SAMSUNG ELECTRO MECH0 citations61
US12228795B2Feb 18, 2025
Imaging lens system
SAMSUNG ELECTRO MECH0 citations57
US12535660B2Jan 27, 2026
Imaging lens system
SAMSUNG ELECTRO MECH0 citations50
US12332548B2Jun 17, 2025
Camera module
SAMSUNG ELECTRO MECH0 citations49
US12200338B2Jan 14, 2025
Lens and lens assembly including the same
SAMSUNG ELECTRO MECH0 citations45
LEE JONG-GI
3 patentsUS8772084B2Jul 8, 2014
Multi-chip semiconductor package and method of fabricating the same
LEE JONG-GI9 citations82
US8288210B2Oct 16, 2012
Semiconductor package, electrical and electronic apparatus including the semiconductor package, and method of manufacturing the semiconductor package
LEE JONG-GI4 citations61
US8664762B2Mar 4, 2014
Semiconductor package, electrical and electronic apparatus including the semiconductor package, and method of manufacturing the semiconductor package
LEE JONG-GI0 citations50
SAMSUNG ELECTRONICS CO LTD
2 patentsUS7612450B2Nov 3, 2009
Semiconductor package including dummy board and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD5 citations62
US7759795B2Jul 20, 2010
Printed circuit board having reliable bump interconnection structure, method of fabricating the same, and semiconductor package using the same
SAMSUNG ELECTRONICS CO LTD2 citations58