P

Inventor

CHANG TING-KUI

TW19 patents

Patents

19 patents
US10269555B2Apr 23, 2019

Post-CMP cleaning and apparatus

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations83
US11211289B2Dec 28, 2021

Metal loss prevention using implantation

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US10643892B2May 5, 2020

Metal loss prevention using implantation

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US9962805B2May 8, 2018

Chemical mechanical polishing apparatus and method

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US9576789B2Feb 21, 2017

Apparatus, method, and composition for far edge wafer cleaning

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations71
US12170195B2Dec 17, 2024

Post-CMP cleaning and apparatus

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12068195B2Aug 20, 2024

Metal loss prevention using implantation

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11728157B2Aug 15, 2023

Post-CMP cleaning and apparatus

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11710659B2Jul 25, 2023

Metal loss prevention using implantation

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11322345B2May 3, 2022

Post-CMP cleaning and apparatus

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12002684B2Jun 4, 2024

Methods for chemical mechanical polishing and forming interconnect structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11705324B2Jul 18, 2023

Apparatus and method for wafer cleaning

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11658065B2May 23, 2023

Chemical mechanical polishing slurry composition, method for chemical mechanical polishing and method for forming connecting structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11508585B2Nov 22, 2022

Methods for chemical mechanical polishing and forming interconnect structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US10998184B2May 4, 2021

Apparatus and method for wafer cleaning

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US12444646B2Oct 14, 2025

Devices with reduced capacitances

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US12046506B2Jul 23, 2024

Devices with reduced capacitances

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US12543553B2Feb 3, 2026

Forming liners to facilitate the formation of copper-containing vias in advanced technology nodes

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10325772B2Jun 18, 2019

Apparatus and method for wafer cleaning

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50