Inventor
LEE CHIA HSUAN
TW9 patents
Patents
9 patentsUS11482450B2Oct 25, 2022
Methods of forming an abrasive slurry and methods for chemical- mechanical polishing
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US11211289B2Dec 28, 2021
Metal loss prevention using implantation
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US10937691B2Mar 2, 2021
Methods of forming an abrasive slurry and methods for chemical-mechanical polishing
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US10643892B2May 5, 2020
Metal loss prevention using implantation
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US12068195B2Aug 20, 2024
Metal loss prevention using implantation
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11710659B2Jul 25, 2023
Metal loss prevention using implantation
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12550695B2Feb 10, 2026
Methods of forming an abrasive slurry and methods for chemical-mechanical polishing
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11532514B2Dec 20, 2022
Structure and formation method of semiconductor device with conductive feature
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US10957587B2Mar 23, 2021
Structure and formation method of semiconductor device with conductive feature
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61