Inventor
OTSUKA TAKUKAZU
JP26 patents
⚠️ This page may combine multiple inventors who share the name “OTSUKA TAKUKAZU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ROHM CO LTD
19 patentsUS7773381B2Aug 10, 2010
Semiconductor device
ROHM CO LTD4 citations74
US9379634B2Jun 28, 2016
Semiconductor device
ROHM CO LTD3 citations73
US11658140B2May 23, 2023
Semiconductor device and fabrication method of the semiconductor device
ROHM CO LTD1 citations72
US11189586B2Nov 30, 2021
Semiconductor device and fabrication method of the semiconductor device
ROHM CO LTD3 citations72
US10790247B2Sep 29, 2020
Semiconductor device and fabrication method of the semiconductor device
ROHM CO LTD3 citations72
US11848295B2Dec 19, 2023
Power semiconductor apparatus and fabrication method for the same
ROHM CO LTD1 citations71
US11302665B2Apr 12, 2022
Power semiconductor apparatus and fabrication method for the same
ROHM CO LTD2 citations71
US7732917B2Jun 8, 2010
Power module
ROHM CO LTD3 citations63
US12176271B2Dec 24, 2024
Semiconductor device
ROHM CO LTD0 citations62
US12074129B2Aug 27, 2024
Semiconductor device and fabrication method of the semiconductor device
ROHM CO LTD0 citations62
US11842949B2Dec 12, 2023
Semiconductor device
ROHM CO LTD1 citations62
US12046532B2Jul 23, 2024
Power module and fabrication method of the same, graphite plate, and power supply equipment
ROHM CO LTD0 citations61
US11367669B2Jun 21, 2022
Power module and fabrication method of the same, graphite plate, and power supply equipment
ROHM CO LTD0 citations61
US12191275B2Jan 7, 2025
Power semiconductor apparatus and fabrication method for the same
ROHM CO LTD0 citations60
US11171071B2Nov 9, 2021
Power module and fabrication method of the power module
ROHM CO LTD0 citations60
US7864533B2Jan 4, 2011
Semiconductor device
ROHM CO LTD0 citations52
US11972997B2Apr 30, 2024
Semiconductor device
ROHM CO LTD0 citations51
US12506123B2Dec 23, 2025
Semiconductor device
ROHM CO LTD0 citations50
US12376349B2Jul 29, 2025
Semiconductor device with switching elements connected in series
ROHM CO LTD0 citations50
OTSUKA TAKUKAZU
4 patentsUS8513806B2Aug 20, 2013
Laminated high melting point soldering layer formed by TLP bonding and fabrication method for the same, and semiconductor device
OTSUKA TAKUKAZU7 citations82
US9673163B2Jun 6, 2017
Semiconductor device with flip chip structure and fabrication method of the semiconductor device
OTSUKA TAKUKAZU4 citations71
US8592986B2Nov 26, 2013
High melting point soldering layer alloyed by transient liquid phase and fabrication method for the same, and semiconductor device
OTSUKA TAKUKAZU1 citations44
US9761506B2Sep 12, 2017
Semiconductor device and fabrication method for the same
OTSUKA TAKUKAZU0 citations38