Inventor
FERRIER DONALD R
13 patents
Patents
13 patentsUS4748104AMay 31, 1988
Selective metallization process and additive method for manufactured printed circuit boards
MACDERMID INC26 citations92
US4976990ADec 11, 1990
Process for metallizing non-conductive substrates
MACDERMID INC65 citations91
US4831210AMay 16, 1989
Shields for electromagnetic radiation
MACDERMID INC29 citations91
US4279948AJul 21, 1981
Electroless copper deposition solution using a hypophosphite reducing agent
MACDERMID INC44 citations91
US4209331AJun 24, 1980
Electroless copper composition solution using a hypophosphite reducing agent
MACDERMID INC49 citations91
US5289630AMar 1, 1994
Process for fabricating multilayer printed circuits
MACDERMID INC35 citations90
US5261154ANov 16, 1993
Process for fabricating multilayer printed circuits
MACDERMID INC34 citations89
US4897118AJan 30, 1990
Selective metallization process, additive method for manufacturing printed circuit boards, and composition for use therein
MACDERMID INC18 citations81
US4782007ANov 1, 1988
Additive method for manufacturing printed circuit boards using aqueous alkaline developable and strippable photoresists
MACDERMID INC19 citations81
US4325990AApr 20, 1982
Electroless copper deposition solutions with hypophosphite reducing agent
MACDERMID INC21 citations81
US4761303AAug 2, 1988
Process for preparing multilayer printed circuit boards
MACDERMID INC20 citations78
US5334240AAug 2, 1994
Aqueous acidic tin-lead immersion plating bath containing weak acid and weak base
MACDERMID INC9 citations73
US5104688AApr 14, 1992
Pretreatment composition and process for tin-lead immersion plating
MACDERMID INC3 citations58