P

Inventor

BARNES MICHAEL

US121 patents
⚠️ This page may combine multiple inventors who share the name “BARNES MICHAEL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

APPLIED MATERIALS INC

24 patents
US6596655B1Jul 22, 2003

Plasma processes for depositing low dielectric constant films

APPLIED MATERIALS INC77 citations99
US6583071B1Jun 24, 2003

Ultrasonic spray coating of liquid precursor for low K dielectric coatings

APPLIED MATERIALS INC146 citations99
US6562690B1May 13, 2003

Plasma processes for depositing low dielectric constant films

APPLIED MATERIALS INC102 citations99
US6541282B1Apr 1, 2003

Plasma processes for depositing low dielectric constant films

APPLIED MATERIALS INC80 citations99
US6414648B1Jul 2, 2002

Plasma reactor having a symmetric parallel conductor coil antenna

APPLIED MATERIALS INC142 citations99
US6348725B2Feb 19, 2002

Plasma processes for depositing low dielectric constant films

APPLIED MATERIALS INC161 citations99
US6303523B2Oct 16, 2001

Plasma processes for depositing low dielectric constant films

APPLIED MATERIALS INC751 citations99
US7955986B2Jun 7, 2011

Capacitively coupled plasma reactor with magnetic plasma control

APPLIED MATERIALS INC70 citations98
US6685798B1Feb 3, 2004

Plasma reactor having a symmetrical parallel conductor coil antenna

APPLIED MATERIALS INC75 citations98
US6660656B2Dec 9, 2003

Plasma processes for depositing low dielectric constant films

APPLIED MATERIALS INC111 citations98
US6617794B2Sep 9, 2003

Method for controlling etch uniformity

APPLIED MATERIALS INC87 citations98
US6569257B1May 27, 2003

Method for cleaning a process chamber

APPLIED MATERIALS INC86 citations98
US6734115B2May 11, 2004

Plasma processes for depositing low dielectric constant films

APPLIED MATERIALS INC67 citations97
US6507155B1Jan 14, 2003

Inductively coupled plasma source with controllable power deposition

APPLIED MATERIALS INC106 citations97
US6869896B2Mar 22, 2005

Plasma processes for depositing low dielectric constant films

APPLIED MATERIALS INC37 citations96
US6694915B1Feb 24, 2004

Plasma reactor having a symmetrical parallel conductor coil antenna

APPLIED MATERIALS INC60 citations96
US6462481B1Oct 8, 2002

Plasma reactor having a symmetric parallel conductor coil antenna

APPLIED MATERIALS INC68 citations96
US6841006B2Jan 11, 2005

Atmospheric substrate processing apparatus for depositing multiple layers on a substrate

APPLIED MATERIALS INC46 citations93
US6409933B1Jun 25, 2002

Plasma reactor having a symmetric parallel conductor coil antenna

APPLIED MATERIALS INC45 citations93
US7560377B2Jul 14, 2009

Plasma processes for depositing low dielectric constant films

APPLIED MATERIALS INC19 citations92
US6930061B2Aug 16, 2005

Plasma processes for depositing low dielectric constant films

APPLIED MATERIALS INC32 citations92
US6598615B1Jul 29, 2003

Compact independent pressure control and vacuum isolation for a turbomolecular pumped plasma reaction chamber

APPLIED MATERIALS INC20 citations92
US6511923B1Jan 28, 2003

Deposition of stable dielectric films

APPLIED MATERIALS INC42 citations92
US6364958B1Apr 2, 2002

Plasma assisted semiconductor substrate processing chamber having a plurality of ground path bridges

APPLIED MATERIALS INC43 citations92

LAM RES CORP

8 patents

NOVELLUS SYSTEMS INC

5 patents

(unassigned)

5 patents

BARNES MICHAEL

2 patents

LAM RESEARCH

1 patent

LANG CHI-I

1 patent

CAMCO DRILLING GROUP LTD

1 patent

HYBRID SYSTEMS INC

1 patent

VENTANA MED SYST INC

1 patent

HARRIS CORP

1 patent

Showing the top 50 of 121 patents by PatentIndex Score.