Inventor
BARNES MICHAEL
US121 patents
⚠️ This page may combine multiple inventors who share the name “BARNES MICHAEL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
24 patentsUS6596655B1Jul 22, 2003
Plasma processes for depositing low dielectric constant films
APPLIED MATERIALS INC77 citations99
US6583071B1Jun 24, 2003
Ultrasonic spray coating of liquid precursor for low K dielectric coatings
APPLIED MATERIALS INC146 citations99
US6562690B1May 13, 2003
Plasma processes for depositing low dielectric constant films
APPLIED MATERIALS INC102 citations99
US6541282B1Apr 1, 2003
Plasma processes for depositing low dielectric constant films
APPLIED MATERIALS INC80 citations99
US6414648B1Jul 2, 2002
Plasma reactor having a symmetric parallel conductor coil antenna
APPLIED MATERIALS INC142 citations99
US6348725B2Feb 19, 2002
Plasma processes for depositing low dielectric constant films
APPLIED MATERIALS INC161 citations99
US6303523B2Oct 16, 2001
Plasma processes for depositing low dielectric constant films
APPLIED MATERIALS INC751 citations99
US7955986B2Jun 7, 2011
Capacitively coupled plasma reactor with magnetic plasma control
APPLIED MATERIALS INC70 citations98
US6685798B1Feb 3, 2004
Plasma reactor having a symmetrical parallel conductor coil antenna
APPLIED MATERIALS INC75 citations98
US6660656B2Dec 9, 2003
Plasma processes for depositing low dielectric constant films
APPLIED MATERIALS INC111 citations98
US6617794B2Sep 9, 2003
Method for controlling etch uniformity
APPLIED MATERIALS INC87 citations98
US6569257B1May 27, 2003
Method for cleaning a process chamber
APPLIED MATERIALS INC86 citations98
US6734115B2May 11, 2004
Plasma processes for depositing low dielectric constant films
APPLIED MATERIALS INC67 citations97
US6507155B1Jan 14, 2003
Inductively coupled plasma source with controllable power deposition
APPLIED MATERIALS INC106 citations97
US6869896B2Mar 22, 2005
Plasma processes for depositing low dielectric constant films
APPLIED MATERIALS INC37 citations96
US6694915B1Feb 24, 2004
Plasma reactor having a symmetrical parallel conductor coil antenna
APPLIED MATERIALS INC60 citations96
US6462481B1Oct 8, 2002
Plasma reactor having a symmetric parallel conductor coil antenna
APPLIED MATERIALS INC68 citations96
US6841006B2Jan 11, 2005
Atmospheric substrate processing apparatus for depositing multiple layers on a substrate
APPLIED MATERIALS INC46 citations93
US6409933B1Jun 25, 2002
Plasma reactor having a symmetric parallel conductor coil antenna
APPLIED MATERIALS INC45 citations93
US7560377B2Jul 14, 2009
Plasma processes for depositing low dielectric constant films
APPLIED MATERIALS INC19 citations92
US6930061B2Aug 16, 2005
Plasma processes for depositing low dielectric constant films
APPLIED MATERIALS INC32 citations92
US6598615B1Jul 29, 2003
Compact independent pressure control and vacuum isolation for a turbomolecular pumped plasma reaction chamber
APPLIED MATERIALS INC20 citations92
US6511923B1Jan 28, 2003
Deposition of stable dielectric films
APPLIED MATERIALS INC42 citations92
US6364958B1Apr 2, 2002
Plasma assisted semiconductor substrate processing chamber having a plurality of ground path bridges
APPLIED MATERIALS INC43 citations92
LAM RES CORP
8 patentsUS6170429B1Jan 9, 2001
Chamber liner for semiconductor process chambers
LAM RES CORP233 citations98
US6042687AMar 28, 2000
Method and apparatus for improving etch and deposition uniformity in plasma semiconductor processing
LAM RES CORP185 citations98
US6013155AJan 11, 2000
Gas injection system for plasma processing
LAM RES CORP294 citations98
US6270862B1Aug 7, 2001
Method for high density plasma chemical vapor deposition of dielectric films
LAM RES CORP88 citations97
US6888040B1May 3, 2005
Method and apparatus for abatement of reaction products from a vacuum processing chamber
LAM RES CORP64 citations96
US6277237B1Aug 21, 2001
Chamber liner for semiconductor process chambers
LAM RES CORP75 citations96
US6062729AMay 16, 2000
Rapid IR transmission thermometry for wafer temperature sensing
LAM RES CORP55 citations96
US5589737ADec 31, 1996
Plasma processor for large workpieces
LAM RES CORP75 citations95
NOVELLUS SYSTEMS INC
5 patentsUS7915139B1Mar 29, 2011
CVD flowable gap fill
NOVELLUS SYSTEMS INC807 citations99
US7888233B1Feb 15, 2011
Flowable film dielectric gap fill process
NOVELLUS SYSTEMS INC572 citations99
US7582555B1Sep 1, 2009
CVD flowable gap fill
NOVELLUS SYSTEMS INC605 citations99
US7524735B1Apr 28, 2009
Flowable film dielectric gap fill process
NOVELLUS SYSTEMS INC166 citations99
US8809161B2Aug 19, 2014
Flowable film dielectric gap fill process
NOVELLUS SYSTEMS INC21 citations93
(unassigned)
5 patentsUS6853141B2Feb 8, 2005
Capacitively coupled plasma reactor with magnetic plasma control
140 citations98
US6818096B2Nov 16, 2004
Plasma reactor electrode
80 citations98
US6893533B2May 17, 2005
Plasma reactor having a symmetric parallel conductor coil antenna
64 citations96
US6829056B1Dec 7, 2004
Monitoring dimensions of features at different locations in the processing of substrates
107 citations96
US6223862B1May 1, 2001
Elevator cable tensioning device and method
52 citations93
BARNES MICHAEL
2 patentsLAM RESEARCH
1 patentLANG CHI-I
1 patentCAMCO DRILLING GROUP LTD
1 patentHYBRID SYSTEMS INC
1 patentVENTANA MED SYST INC
1 patentHARRIS CORP
1 patentShowing the top 50 of 121 patents by PatentIndex Score.