Inventor
YAMASHITA CHIKARA
JP10 patents
⚠️ This page may combine multiple inventors who share the name “YAMASHITA CHIKARA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NEC CORP
8 patentsUS5763939AJun 9, 1998
Semiconductor device having a perforated base film sheet
NEC CORP157 citations98
US5668405ASep 16, 1997
Semiconductor device with a film carrier tape
NEC CORP289 citations98
US5789820AAug 4, 1998
Method for manufacturing heat radiating resin-molded semiconductor device
NEC CORP53 citations95
US5509203AApr 23, 1996
Method for manufacturing a sheet formed connector for inspection of an integrated circuit
NEC CORP57 citations95
US6432807B1Aug 13, 2002
Method of forming solder bumps on a semiconductor device using bump transfer plate
NEC CORP24 citations89
US5777387AJul 7, 1998
Semiconductor device constructed by mounting a semiconductor chip on a film carrier tape
NEC CORP44 citations89
US6501175B2Dec 31, 2002
Semiconductor device with semiconductor chip on flexible tape
NEC CORP14 citations83
US5643802AJul 1, 1997
Method of producing a semiconductor device by gang bonding followed by point bonding
NEC CORP11 citations73