Inventor
ORIMO SEIICHI
JP12 patents
Patents
12 patentsUS6255740B1Jul 3, 2001
Semiconductor device having a lead portion with outer connecting terminals
FUJITSU LTD122 citations99
US6072239AJun 6, 2000
Device having resin package with projections
FUJITSU LTD241 citations99
US5656550AAug 12, 1997
Method of producing a semicondutor device having a lead portion with outer connecting terminal
FUJITSU LTD366 citations99
US6433418B1Aug 13, 2002
Apparatus for a vertically accumulable semiconductor device with external leads secured by a positioning mechanism
FUJITSU LTD178 citations98
US6025650AFeb 15, 2000
Semiconductor device including a frame terminal
FUJITSU LTD220 citations98
US6333564B1Dec 25, 2001
Surface mount type semiconductor device and method of producing the same having an interposing layer electrically connecting the semiconductor chip with protrusion electrodes
FUJITSU LTD87 citations97
US6288444B1Sep 11, 2001
Semiconductor device and method of producing the same
FUJITSU LTD80 citations96
US6159770ADec 12, 2000
Method and apparatus for fabricating semiconductor device
FUJITSU LTD212 citations96
US5930603AJul 27, 1999
Method for producing a semiconductor device
FUJITSU LTD77 citations96
US6856017B2Feb 15, 2005
Device having resin package and method of producing the same
FUJITSU LTD13 citations92
US6094356AJul 25, 2000
Semiconductor device and semiconductor device module
FUJITSU LTD21 citations92
US7144754B2Dec 5, 2006
Device having resin package and method of producing the same
FUJITSU LTD1 citations63